Cho B-G – TechConnect Briefs

A Study on Numerical Analysis of Stress Distribution for Thermal Nanoimprint Lithography Process

Cho B-G, Won T., Inha University, KR

We investigated the deformation of the viscoelastic polymethyl methacrylene (PMMA) resist wherein a rigid SiO2 stamp with a rectangular line pattern is imprinted for thermal nano-imprint lithography (NIL). We calculated the stress distribution in the [...]

Atomistic Simulation on Boron Transient Diffusion during in Pre-amorphized Silicon Substrate

Park S.Y., Cho B-G, Won T., Inha University, KR

We investigated the boron diffusion in the silicon posterior to PAI (pre-amorphization implant) in order to understand the mechanism for amorphization process and generation-recombnation of defects. Silicon atoms were weighed as a new pre-amorphization implant [...]

Numerical Stress Analysis on Thermal Nano-Imprint Lithography

Cho B-G, Park S.Y., Won T., Inha University, KR

This paper investigations the stress distribution of the polymer through numerical simulations during thermal NIL. Numerical results explained characteristic phenomena which never appear in continuous line-and-space patterning cases. We believe that numerical simulations with more [...]