A Study on Numerical Analysis of Stress Distribution for Thermal Nanoimprint Lithography Process

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We investigated the deformation of the viscoelastic polymethyl methacrylene (PMMA) resist wherein a rigid SiO2 stamp with a rectangular line pattern is imprinted for thermal nano-imprint lithography (NIL). We calculated the stress distribution in the polymer resist during the molding process by finite element method (FEM). Our simulation results revealed asymmetric von Mises stress distribution for the polymer around the external line, which is due to the squeezing flow under the flat space. The stress seems to concentrate at the sidewall which is close to the centerline of the whole structure. Our simulation revealed that micro gap is formed between the replicated structure and the outer wall of the mold.

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Journal: TechConnect Briefs
Volume: 3, Nanotechnology 2009: Biofuels, Renewable Energy, Coatings, Fluidics and Compact Modeling
Published: May 3, 2009
Pages: 272 - 275
Industry sector: Advanced Materials & Manufacturing
Topics: Informatics, Modeling & Simulation
ISBN: 978-1-4398-1784-1