Numerical Stress Analysis on Thermal Nano-Imprint Lithography

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This paper investigations the stress distribution of the polymer through numerical simulations during thermal NIL. Numerical results explained characteristic phenomena which never appear in continuous line-and-space patterning cases. We believe that numerical simulations with more accurate material properties have possibilities to agree with experiments better enough for practical use. Our simulation approach could further be extended to accommodate deformation of the stamp and the sub-polymer platen.

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Journal: TechConnect Briefs
Volume: 1, Nanotechnology 2008: Materials, Fabrication, Particles, and Characterization – Technical Proceedings of the 2008 NSTI Nanotechnology Conference and Trade Show, Volume 1
Published: June 1, 2008
Pages: 277 - 279
Industry sector: Advanced Materials & Manufacturing
Topics: Composite Materials
ISBN: 978-1-4200-8503-7