Thermo-Mechanical Characterization and Integrity Checking of Packages and Movable-Structures
Szabo P., Perlaky G., Bognar Gy., Horvath Gy., Ress S., Poppe A., Rencz M., Courtois B., Budapest University of Technology and Economics, HU
The paper will present a variety of possibilities for the thermal characterization of different movable MEMS devices and packaging. It will discuss the major difficulties in these methodologies and the ways to overcome them. Comparison [...]