ETH Zürich – Page 5 – TechConnect Briefs

Hybrid Atomistic-Continuum Fluid Mechanics

Werder T., Walther J.H., Kotsalis E., Gonnet P., Koumoutsakos P., ETH Zürich, CH

We outline a multiscale algorithm for the simulation of dense uids that couples molecular dynamics and continuum fluid dynamics. The coupling between the two models is realized by a common overlap domain and by the [...]

Wetting and Hydrophobicity of Nanoscale Systems with Impurities

Gonnet P., Zimmerli U., Walther J.H., Werder T., Koumoutsakos P., ETH Zürich, CH

Molecular dynamics simulations are performed to study the influence of surface and fluid impurities on water-carbon interfaces. In order to quantify these interactions we consider both the canonical problem of wetting of a doped flat [...]

Moment-based Analysis of Mechanical Effects on Trench-Hall Devices

Taschini S., Korvink J.G., Baltes H., ETH Zürich, CH

This paper presents a novel method for the assessment of mechanical effects on trench-Hall devices based on a moment expansion combined with two-dimensional finite-element discretization. Analogously to plate theories, a truncated moment expansion of the [...]

Offset Analysis in CMOS Magnetotransistors by Numerical Simulation

Metz M., Baltes H., ETH Zürich, CH

Signal offset in magnetotransistors is for the first time analyzed by numerical simulation. Offset needs to be mini-mized to improve the accuracy of low cost CMOS contact-less angle detection systems. The offset is an unwanted [...]

Optimal Time Stepping in the Thermo-mechanical Finite Element Simulation of IGBTs Modules

Tronel Y., Fichtner W., ETH Zürich, CH

In the analysis of the thermo-mechanical response of the wire bond connection found e.g in IGBTs modules, it has been found that the level of stresses are within the plastic range [1]. Therefore an incremental [...]

CMOS MEMS and their Simulation

Korvink J.G., Emmenegger M., Taschini S., Baltes H., ETH Zürich, CH

The most appropriate tools for the modelling and simulation of MEMS are strongly related to the technology used to fabricate them. CMOS MEMS are naturally combined with circuitry, and in a packaged form they are [...]