US – Page 66 – TechConnect Briefs

Wafer-Scale Planarization using Location Specific Gas Cluster Ion Beam (GCIB) in Advanced CMOS Logic Technology

Moon Y., Qin L., Koli D., Snow C., GlobalFoundries, US

In sub-14nm advanced CMOS logic technology, controlling wafer-scale planarization or uniformity became tremendously critical. This is mainly due to the CMOS integration scheme where chemical mechanical polishing (CMP) is used to create the transistor gate. [...]

DNA Double-Write Photolithography: A Synergy for Top-Down and Bottom-Up Nanofabrication

Heller M.J., Song Y., University of California San Diego, US

Intrinsic programmability and other unique properties of DNA allow it to be used as a self-assembly nanostructure material, easily functionalized with nanoparticles and other entities, and as a UV sensitive write material for patterning. Thus, [...]

Key Elements of a Responsible Development Plan for Nanomanufacturing

Hodson L.L., Geraci C.L., National Institute for Occupational Safety and Health, US

Responsible development of nanotechnologies includes considering and managing the potential, unintended consequences to human health and the environment that might accompany development and use of the technology. Key to ensuring the safety of your business, [...]

Scalable Polymer Patterning (SP2)

Mead J., Barry C., University of Massachusetts-Lowell, US

Polymeric materials are easily fabricated into a wide array of structures for numerous applications. The bulk properties can be tailored for preparing novel structures and substrates for use as substrates for 3D printing. Particularly, the [...]

NETZSCH Nanotechnology Advancements and Applications

Miranda S., Smith R., NETZSCH Premier Technologies, US

Size reduction into the nanometer size range offers many advantages. These include increased surface area, improved reactivity, efficient absorption and higher efficacy of active ingredients. This presentation will discuss methods for Comminution and dispersion of [...]

The benefits and challenges of Industry-Start Up-University collaboration for product development

Silveston-Keith R., University Industry Demonstration Partnership, US

There is an emerging trend for corporate R&D groups to engage with startups as corporations need to increase the pace of finding breakthrough technologies and make rapid transfer of science and technology into the marketplace. [...]

High-rate Manufacturing of 3D Products with Nanostructured Surfaces

Barry C., De Jesus Vega M., Mead J., University of Massachusetts-Lowell, US

Injection molding permits manufacturing of complex three-dimensional polymer products with nanostructured surfaces in less than 30 seconds. New work has explored the practical limits of feature size during injection molding. Surfaces with a range of [...]

Rapid Printed Tooling for High-rate Production of Microstructured Surfaces

De Jesus Vega M., Shearer J., Mead J., Barry C., University of Massachusetts-Lowell, US

Method for production of tooling for microstructure surfaces

Intense Pulsed Light Sintering and Reduction of Facile Copper Hydroxide Synthesis towards Printable Copper Contacts

Druffel T., Dharmadasa R., Draper G., University of Louisville, US

The printed electronics market is a rapidly growing field, with the market set to reach $3.6B by 2018. Conductive inks are used in a vast variety of technologies. Inks are typically composed of metallic particles [...]

Customized Manufacture of Protective Headgear for Primary Prevention of Fall Related Traumatic Brain Injuries

Ferguson J., Caccese V., Castle S., University of Maine, US

Alba-Technic, LLC and the University of Maine are developing an automated small batch manufacturing system that streamlines both the customization and manufacture of a protective headgear designed for aesthetic appeal and comfort by using advanced [...]