US – Page 470 – TechConnect Briefs

Analytic 3D Greens Function Approach to Scattering and Diffraction from Patterned and/or Imperfect Multilayers

Gallatin G.M., Bell Labs, Lucent Technologies, US

The 3D electromagnetic Greens function Gij(x,x) for planar multilayers is constructed from the eigenmodes of Maxwellís equations in the multilayer structure. Other approaches hav been used to derive the Greens function and the derivation here [...]

A Design Tool for Inductive Position and Speed Sensors via a Fast Integral Equation Based Method

Kamon M., Nguyen A-M., Gilbert J.R., Microcosm Technologies, Inc., US

This paper describes using 3D integral equation based simulation in combination with simulation managment to provide a design tool for an eddy-current inductive position and speed sensor under development at CSEM Microsystems. Both the frequency [...]

Investigation of Tetrhedral Automatic Mesh Generation for Finite-Element Simulation of Micro-Electro-Mechanical Switches

Wilson N.M., Pinsky P.M., Dutton R.W., Stanford University, US

Simulation of micro-electro-mechanical systems (MEMS) typically involves the requirement to mesh complex 3-D representations of the geometry. Since proper manual or semi-automated mesh generation requires significant user time and knowledge, there is great interest in [...]

Intelligent Automatic Meshing of Multilayer CMOS Micromachined Structures for Finite Element Analysis

Lakdawala H., Baidya B., Mukherjee T., Fedder G.K., Carnegie Mellon University, US

In this paper, we describe an automatic technique for meshing multilayer CMOS micromachined structure for Finite Element Analysis (FEA) from device layout. The technique is based on a 3D canonical representation of the different CMOS [...]

Modeling of Piezoelectric MEMS Using the Finite Cloud Method

Ohs R.R., Aluru N.R., University of Illinois, US

In this paper we present a meshless based Finite Cloud Method (FCM) for the numerical solution of partial differential equations (PDEs) governing piezoelectricity. Using a point distribution, FCM constructs interpolation functions without assuming any connectivity [...]

Compact Modeling of Bistable Electrostatic Actuators

Xu J., Darling R.B., Lauritzen P.O., University of Washington, US

A compact circuit simulation model for a bistable electrostatic cantilever actuator is presented which is appropriate for circuit and system simulation of RF MEMS switches. This simplified model captures the essential physical features of a [...]

A Compact Model for an IC Lateral Diffused MOSFET Using the Lumped-Charge Methodology

Subramanian Y., Lauritzen P.O., Green K.R., Texas Instruments, US

A compact model for an IC Lateral Diffused MOSFET is developed using the Lumped-Charge Methodology[1]. Model equations and key performance characteristics are documented. They satisfy the requirements of Power MOSFET models[2], unlike the competitive macromodels [...]

Parameterized Electrostatic Gap Model for Structured Design of Microelectroelectrical Systems

Lu M.S., Fedder G.K., Carnegie Mellon University, US

VLSI system designers can begin their design process with a behavrioal description of a system, then proceed to physical design. MEMS designers typiclly begin with device design, this process is opten followed by several fabrication [...]

A Methodology for System Level Simulation, Modeling and Optimization of MEMS Devices

Nguyen L., Lee H.J., Maher M.A., von Sosen H., Tanner Research, Inc., US

A Methodology for System Level Simulation, Modeling and Optimization of MEMS Devices Categories: Co-simulation and Optimization System, Multi-level Modeling Linh Nguyen, Hee Jung Lee, Mary Ann Maher, and Harald von Sosen Tanner Research, Inc. VLSI [...]

Electro-Mechanical Transducer for MEMS Analysis in ANSYS

Gyimesi M., Ostergaard D., ANSYS, Inc., US

The paper introduces an electro-mechanical transducer finite element (EMT) for the strongly coupled simulation of micro electro-mechanical system (MEMS) devices in the commercial finite element analysis (FEA) package ANSYS.