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Multiphysics Modeling and Simulation for a MEMS Thermal-Mechanical Switch

Wang W., Popuri R., Onishi S., Bumgarner J., Langebrake L., University of South Florida, US

This paper presents the results of finite element analysis (FEA) modeling and simulation including thermal-electric-structural multiphysics contact phenomenon for a MEMS thermal-mechanical DC switch. The parametric model can be used for design optimizations.The switch consists [...]

Manipulation of Capillary force by Electrowetting for Micromanipulation

Chandra S., Batur C., University of Akron, US

Microassembly is the future of MEMS and NEMS technology. But greatest barrier to the idea of micro scale assembly is micromanipulation. The steps in micromanipulation are pickup, moving and releasing and the most difficult part [...]

Parameterizable Library Components for SAW Devices

Wilson W.C., Atkinson G.M., NASA Langley Research Center, US

The lack of integrated design tools for SAW devices has led us to develop tools that in the future will enable integrated design, modeling, simulation, analysis and automatic layout generation of Surface Acoustic Wave (SAW) [...]

Microcantilever Sensor via Second Order Sliding Mode Control

English J., Shtessel Y., Yegnaraman M., George M., University of Alabama in Huntsville, US

Improved sensor measurements using second-order sliding mode control of a mass sensor based on a microcantilever is considered. The microcantilever-based mass sensor detects mass loading via deflections in nanometer scale. The polymer-coated cantilever is exposed [...]

MEMS Process Characterization with an on-Chip Device

Garmire D., Choo H., Muller R.S., Govindjee S., Demmel J., UC-Berkeley, US

We have developed a CMOS-compatible, compact device and a simple procedure for measuring three important fabrication characteristics of planar-processed microelectromechanical (MEMS) structures: in-plane over- or under-cut, Young’s Modulus, and comb-drive forces in a MEMS process. [...]

Mechanical Properties Measurements of 0.35-µm BiCMOS MEMS Structures

Liu J., Fedder G.K., Sassolini S., Sarkar N., Carnegie Mellon University, US

A new Young’s modulus test structure has been designed and used in our lab. Simple models have been built in simulating lateral and vertical stress gradients. Test structures, measurements and FEA simulations are reported on [...]

Numerical Capacitance Calculation for Mems Pressure Sensor by Method of Moments

Li P., Weber R.J., Iowa State University, US

MEMS-based capacitive pressure sensors have been widely used in many engineering applications. The design of a MEMS capacitance pressure sensor presents a number of challenges, one of which is the calculation of sensor capacitance and [...]

Analytical Models for Quantized Sub-Band Energy Levels and Inversion Charge Centroid of MOS Structures Derived from Asymptotic and WKB Approximations

Abebe H., Cumberbatch E., Morris H., Tyree V., USC/ISI, US

Quantum effects on MOS structures investigation.

Systematic Approach on Modeling and Identification for Nanobattery Prototyping

Bhattacharya P., Ye Z., Walker E., Lacy F., Banerjee M., Southern University, US

Nanobattary microstructure consists of anode, cathode, electrolyte, separator for miniaturized power source. Miniaturization is a challenging area of research. Miniature power sources have a variety of applications on miniature power-controlled devices. Li-Ion is selected by [...]

A Nyström-Like Approach to Integral Equations with Singular Kernels

Kuo S.-H., White J.K., Massachusetts Institute of Technology, US

When boundary element methods are used to solve Laplace or Helmholtz problmes associated with complicated three-dimensional geometries, the associated integral equation is typically discretized using a piecewise constant basis, and a system of equations is [...]