US – Page 154 – TechConnect Briefs

Analysis and Measurement of Ink Media Interactions in Inkjet Printing

Sharma R., Bedford E., Brys B., Viswanath K.T., Furlani E.P., Cabot Corporation, US

The development of modern inkjet printing systems is a complex process that requires an interdisciplinary team to address numerous critical and fundamental issues encountered throughout the commercialization cycle. An inkjet development effort spans a broad [...]

Lumped Electro-Thermo-Mechanical Beam Model

Chigullapalli A., Purdue University, US

In this paper we present a lumped electro-thermo-mechanical beam model. Such a model is important for efficiently computing the deflection of an assemblage of mechanical beams that are subject to one or more applied voltages, [...]

MEMS Oscillators

Partridge A., SiTime Corp, US

MEMS oscillators are now replacing legacy quartz crystal oscillators. They provide higher performance, new features, improved reliability, shorter lead times, and reduced cost. We will present the highest performance MEMS oscillator to date, discussing the [...]

Temperature and Strain Response of a Surface Acoustic Wave Sensor

Wilson W.C., Atkinson G.M., NASA Langley Research Center, US

A new multifunctional temperature and strain sensor is being investigated. The new sensor is based upon Surface Acoustic Wave (SAW) technology on a Langasite substrate. SAW sensors can be developed that respond to changes in [...]

Measuring the layer thickness of MEMS using torsional resonance

Andrews N.D., Clark J.V., Purdue University, US

In this work we propose a method to measure the structural layer thickness of MEMS using torsional resonance. The thickness of structures often has measurable influences on the mechanical, thermal, and electrical behaviors. Measurement of [...]

Measuring System Mass and Density of MEMS by Electronic Probing

Chigullapalli A., Purdue University, US

In this paper we propose a method to measure the system mass and material density of a common type of micro electromechanical systems (MEMS). Measurement can be done on- or off-chip.To examine the feasibility of [...]

Design of a nano-mechanical beam based memory element

Sahoo H.K., Uppala A., Anjur R., University of Pennsylvania, US

A cantilever beam based memory element is proposed which can trap static charge on a metal plate on the beam. The charge is tunneled to the metal plate from an electrode separated from it by [...]

Soft X-Ray Lithography for High-Aspect Ratio Sub-Micrometer Structures

Goettert J., Lemke S., Rudolph I., Seliger T., Loechel B., Louisiana State University, US

Combining soft x-ray lithography with SiN mask membrane and newly developed high contrast negative resist mr-X (micro resist technology GmbH, Berlin, Germany) enables the cost-effective patterning of sub-micrometer high aspect ratio structures. This work builds [...]

Advances in MEMS Fabrication for Fabless MEMS Companies

Lim M., Daneman M., InvenSense, US

InvenSense, a fabless MEMS company has successfully transferred its proprietry fabriction process has been to multiple foundries to support high volume production of multiple products. The process supports CMOS electronics integration and incorporates wafer level [...]

Is one gyroscope enough?

Capovilla M., STMicroelectronics, US

Market requirements push on small, lightweight portable device with advance feature for user interface, gesture recognition and camera features. New generation of portable device required gyroscope sensing capability for advanced gaming, high-performance motion detection, gesture [...]