PL – TechConnect Briefs

Economy driven SiC Power Electronics Technology Development supported by the ECSEL Joint Undertaking framework program funds

Bieniek T., Janczyk G., Sitnik A., Messina A., Łukasiewicz Research Network – Institute of Microelectronics and Photonics, PL

This paper presents the European project REACTION (first and euRopEAn siC eigTh Inches pilOt liNe) which was launched in 2018 to push throughout the new and European first 200mm (8”) SiC Pilot Line in the [...]

Smart Power and Power Discretes Hardware-software co-design for reliability improvement of BLDC power drivers for eMobility by key BCD Technologies running in Europe

Janczyk G., Bieniek T., Łukasiewicz Research Network – Institute of Microelectronics and Photonics, PL

Growing market of microcontroller driven electronic devices useful for workshop tools, household appliances, electromobility applications and functional gadgets market demand stimulates the increase of customer expectations for product functionality flexibility, reliability and price. IC fabrication [...]

The “first and euRopEAn siC eigTh Inches pilOt line” REACTION project as a Driver for key European SiC Technologies focused on Power Electronics Development

Bieniek T., Janczyk G., Sitnik A., Messina A., Instytut Technologii Elektronowej, PL

This paper presents the European project REACTION (first and euRopEAn siC eigTh Inches pilOt liNe) [1] [2] which was launched in 2018 to push throughout the new and European first 200mm (8”) SiC Pilot Line [...]

R3-PowerUP – the Driver for key European BCD Technologies Development focused on Smart Power and Power Discretes ICs

Janczyk G., Bieniek T., Institute of Electron Technology, PL

Numerous, growing number of power electronic applications operate below 1kV. The “300mm Pilot Line for Smart Power and Power Discretes” ECSEL project [1] (acronym R3-PowerUP) is focused on volume up-scaling of a set of 90nm [...]

XTPL Approach to Print Submicron Conductive Lines on Dielectric Substrates

Kowalczewski P., Wiatrowska A., Dusza M., Zięba M., Cichoń P., Fijak K., Granek F., XTPL SA, PL

The concepts of printed electronics offer a tremendous potential when brought to nanotechnology. We present a novel technology for printing submicron conductive lines at unprecedented flexibility, accuracy, and low cost. The lines with resistivity down [...]

European Activity for Smart Power Electronics and Power Discretes – The R3-PowerUP EU Project

Bieniek T., Janczyk G., Instytut Technologii Elektronowej, PL

Smart power ICs are key enabling components for various applications from mid-power automotive, to industrial power, battery management systems electric vehicles, domotics, indoor and outdoor lighting, computers and industrial peripherals. Power electronics serves over 30% [...]

The Multifunctional 3D Interposer Platform for HPC – Development, Measurements, Design Guidelines

Janczyk G., Bieniek T., Instytut Technologii Elektronowej, PL

This paper presents dedicated solutions developed in frame of the EU FP7 CarrICool project focused on the modular interposer system architecture providing scalable heat removal, local power delivery and optical signaling issues critical for high [...]

Graphenoid plates in glioma therapy.

Grodzik M., Szczepaniak J., Strojny B., Jaworski J., Wierzbicki M., Jagiello J., Soltan E., Mandat T., Warsaw University of Life Sciences (WULS), PL

Glioblastoma multiforme (GBM) is a malignant primary tumour. The presence of necrotic areas and atypical vascularisation as well as the presence of atypical cells with nuclear pleomorphism and high proliferative ratio constitute the most important [...]

Multi-cantilever array sensor system with MOEMS read-out

Bieniek T., Instytut Technologii Elektronowej, PL

Cantilever beams-based sensor systems become a sensor family applicable in several high-end technology research areas. The outstanding sensitivity and phenomenon selectivity of such systems profits from functionalization technique available for cantilever beams surface. High selectivity [...]

CarrICool – the Innovative 3D Interposer Platform for HPC Systems: Analysis, Simulations, Optimization, Practice for Reliability Improvement and Performance Increase

Janczyk G., Bieniek T., Bajurko P., Instytut Technologii Elektronowej, PL

This paper presents specific solutions being developed in frame of the CarrICool (abbr. “Modular Interposer System Architecture providing scalable Heat Removal, Power Delivery and Optical Signaling”) European FP7 project. The presented research and developed solutions [...]