The Multifunctional 3D Interposer Platform for HPC – Development, Measurements, Design Guidelines


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This paper presents dedicated solutions developed in frame of the EU FP7 CarrICool project focused on the modular interposer system architecture providing scalable heat removal, local power delivery and optical signaling issues critical for high performance computer systems (HPC). It effectively extends available effectiveness of cooling techniques over 600W/cm2 and introduces new integration capabilities supporting system optimization in power delivery, power dissipation, performance and reliability domains. Buck converters embedded within the interposer result in effective power delivery features. Optical link opens the interposer for cutting edge communication technologies. Planar and interlayer routing capabilities respecting electrical signal integrity constrains assure data transmission over 10GHz range as physical constrains have been identified and estimated.

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Journal: TechConnect Briefs
Volume: 4, Informatics, Electronics and Microsystems: TechConnect Briefs 2018
Published: May 13, 2018
Pages: 59 - 62
Industry sector: Sensors, MEMS, Electronics
Topics: Advanced Manufacturing, Nanoelectronics
ISBN: 978-0-9988782-1-8