Numerous, growing number of power electronic applications operate below 1kV. The “300mm Pilot Line for Smart Power and Power Discretes” ECSEL project  (acronym R3-PowerUP) is focused on volume up-scaling of a set of 90nm and 110nm BCD technologies operated by STMicroelectronics. High volume FABs capable to produce relatively cheap power electronic components are necessary to lower power electronics hardware cost. R3-PowerUp project supports technology migration from 200mm diameter substrates size used in existing BCD technologies to 300mm wafers to be processed in European pilot line facility oriented on Smart Power IC fabrication . This paper focuses on power electronics hardware solutions applicable for brushless, direct current (BLDC) motors driver development pursued by the authors’ team and R3- PowerUP project partners. Available BLDC driving modes have been presented. Hardware implementation scenarios available for fully integrated and for hybrid solutions are also discussed.
Journal: TechConnect Briefs
Volume: TechConnect Briefs 2019
Published: June 17, 2019
Pages: 252 - 255
Industry sector: Sensors, MEMS, Electronics
Topicss: Nanoelectronics, Sensors - Chemical, Physical & Bio