TechConnect Briefs
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeCountriesDE

Country: DE

Germany

Simulation of Heat-Transfer Enhancement Effects in Microreactors

Hardt S., Ehrfeld W., Hessel V., Vanden Bussche K.M., Institut für Mikrotechnik Mainz GmbH, DE
Sate-of-the-art microstructuring techniques allow to model the interface for heat and mass transfer in miniaturized reactions systems on a micrometer scale. In this context, two different approaches for heat transfer enhancement are presented. The ideas [...]

Impact of Microdrops on Solid Surfaces for DNA-Synthesis

Maier C., aus der Wiesche S., Hofer E.P., University of Ulm, DE
The miniaturization of chemical synthesis procedures and their integration in complex microfluidic systems is highly interesting both commercially and scientifically. Here, dosing of microdrops for activation or passivation with high accuracy on a substrate or [...]

Investigation of High Frequency Noise in a SiGe HBT Based on Shockley’s Impedance Field Method and the Hydrodynamic Model

Decker S., Neinhus B., Heinemann B., Jungemann C., Meinerzhagen B., University of Bremen, DE
This paper presents the first simulation of the minimum noise figure of a heterojunction bipolar transistor based on Shockley's impedance field method and the hydrodynamic model. The hydrodynamic model and the impedance field method are [...]

Modeling of High-speed Diamond Microswitch

Schmid P., Adamschik M., Ertl S., Kohn E., University of Ulm, DE
CVD grown diamond is a new attractive MEMS material and has been used here to realize a microswitch with extreme properties. Still at present the technological development requires a fast turnaround of the design based [...]

A FEM Based Network Approach for the Simulation of Miniaturized Electromagnetic Devices

Gollee R., Gerlach G., Dresden University of Technology, DE
The paper proposes a new computational approach for analyzing miniaturized electromagnetic devices. This approach is based on a general structure of an equivalent network for the coupled electromagnetic problem. It enables automated derivation of the [...]

Integration of a Permeable Layer into Micro Coil Modelling and First Steps of Automatic Optimization

Rehfuß S., Peters D., Laur R., University of Bremen (ITEM), DE
Rectangular micro coils which are used in a wide range of applications (e.g. medical or automotive area) are the main components of appropriate wireless transmission systems for frequencies up to 20 MHz. As shown in [...]

Investigation of Cross-Coupling and Parasitic Effects in Microelectromechanical Devices on Device and System Level

Schrag G., Zelder G., Wachutka G., Münich University of Technology, DE
With progressing monolithic integration of entire micro-electromechanical systems on one chip fabricated by standard IC technology we have to cope with the problem that the operation of embedded transducer elements is considerably affected by cross-coupling [...]

HDL-A-Model of a Micromachined Tuning Fork Gyroscope

Eichholz J., Quenzer J., Schwarzelbach O., Weiß M., Wenk B., FhG-ISIT, DE
The HDLA-model presented describes the electrical and mechanical behavior of a micromachined silicon tuning fork gyroscope. This gyro will be excited by electrostatic forces and the Coriolis induced torsion motion will be read out capacitively. [...]

Methodology of Macromodeling Demonstrated on Force Feedback S/D-Architectures

Hardtmann M., Aigner R., Nadal R., Wachutka G., Münich University of Technology, DE
Design and verification of complete microsystems require effective models of the micromechanical components for the simulation at system level. Particularly for force feedback S/D-architectures, long transient simulations are inevitable to characterize the system-inherent signal pro-cessing. [...]

Compact MEMS Modeling for Design Studies

Voigt P., Wachutka G., University of Technology, DE
A method for MEMS macromodel development is presented which is based on a physical device description to obrain mathematical relations for the device operation. Since design and technlogy parameters are input parameters of the resulting [...]

Posts pagination

« 1 … 35 36 37 … 40 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.