Thermo-Mechanical Modeling – TechConnect Briefs

Papers:

Reduced Electro-Thermal Models for Integrated Circuits

Furmanczyk M., Napieralski A., Szaniawski K., Tylman W., Lara A., Technical University of Lodz, PL

Power dissipation density in today's integrated circuits makes thermal problems very important. Unfortunately, the electro-thennal co-simulations, which are often indispensable in solving thennal issues, are constrained by the lack of the IC's electro-thermal models. This [...]

Elements for Modeling Diffused Piezoresistor Temperature Coefficient and Sensitivity

Mladenovic D., Hutchins J., Tran E., Lu S., Motorola, US

This article reviews elements needed to be considered in order to improve accuracy of the temperature coefficient and sensitivity (span) simulation for diffused piezoresistors. Modeling is done through an algorithm developed in 'Mathematica'. Input parameters [...]

A Least Squares Algorithm for Optimal Heater Placement in Microsensors

Liu C.C., Man P.F., Mastrangelo C.H., University of Michigan, US

In this paper we present an algorithm that yields the optimal placement of a finite number of constant power density heaters for an arbitrary desired temperature profile. Using this algorithm, the volume efficiency (the percentage [...]

Extraction of Dynamic HDL-A Models of Thermally Based Microsystems from Physical Simulations

Marco S., Carmona M., Samitier J., Universitat de Barcelona, ES

While analyzing the behaviour of complex systems it is not practical to carry out the simulation of the complete model a the physical level In order to move from simulations at tne physical level towards [...]

Electro-Thermo-Mechanical Simulations of Aluminum Bond Wires in IGBT-Packages

Hager C., Tronel Y., Fichtner W., ETH-EPFL, CH

Finite-element simulations have been performed on aluminum wires as used in modern IGBT (Insulated Gate Bipolar Transistor) power modules. These wires were ultrasonically bonded to thin molybdenum plates and the influence of different origins of [...]

Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated Electronics

Sieiro J., Morrissey A., Carmona M., Marco S., Samitier J., Alderman J., Universitat de Barcelona, ES

This paper descubes the thermal behaviour of vertical multichip module (V-MCM) devised within the BARMINT Esprit Project. It encloses an stack of elements including several ICs. a micromachined pump, and a multisensor chip provided with [...]

Journal: TechConnect Briefs
Volume: Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems
Published: April 6, 1998
Industry sector: Sensors, MEMS, Electronics
Topics: MEMS & NEMS Devices, Modeling & Applications, Modeling & Simulation of Microsystems
ISBN: 0-96661-35-0-3