Papers:
Numerical Simulations of Sputter Deposition and Etching in Trenches Using the Level Set Technique
We have performed 2D and quasi-3D numerical simulations of physical vapor deposition (PVD) into high aspect ratio trenches used for modern VLSI interconnects. The topographic evolution is modeled using (continuum) level set methods. The level [...]
TopoSim3D/Grain3D: Modeling Surface Deposition and Growth
We discuss the coupling we are develping between TopoSim3D and Grain3D - two tols making use of the Los Alamos LaGriT adaptive grid toolset. TopoSim3D is a three-dimensional profile simulation tool being developed at Los [...]
Modeling Facet Growth of Cu Thin Films
We present a Kinetic Lattice Monte Carlo (KLMC) model, which describes deposition, surface self-diffusion, nucleation, and film growth on fcc metal substrates. The activation energies for diffusion are calculated using embedded-atom method (EAM). Using this [...]
Computational Modeling with a New Lattice-Based Continuum Formulation for the Coupled Thermodynamic and Mechanical Equilibrium of Polycrystalline Solids
A new formulation and computational framework is presented for modeling coupled self-diffusion and mechanics in polycrystalline materials. The continuum formulation includes constitutive models derived from lattice-level thermodynamic and mechanical considerations. From a complete statement of [...]
3D Modeling of Metallic Grain Growth
This paper will describe simulating metallic grain growth using our Gradient Weighted Moving Finite Elements code, GRAIN3D. We also describe the set of mesh topology change operations developed to respond to changes in the physical [...]
Monte Carlo Modeling of Thin Film Deposition: Influence of Grain Boundaries on the Porosity of Barrier Layer Films
Dalla Torre J., Gilmer G.H., Windt D.L., Baumann F.H., Huang H., Díaz de la Rubia T., Djafari-Rouhani M., Bell Labs, Lucent Technologies, US
We present Monte Carlo simulations of metallic thin films grown by sputter deposition from an infinite target. The Monte Carlo model includes ballistic deposition from the target, surface diffusion, and polycrystalline film growth. We study [...]
Modeling Nucleation and Growth of Voids During Electromigration
We calculate the formation energy of small voids in Al and Cu, both at the bulk and at grain boundaries, using the Embedded Atom Method. Then, we use those results as input to a Kinetic [...]
Molecular Dynamics Study of Thermally Induced Shear Strain in Nanoscale Copper
We study the effects of thermally induced shear strain and stress in several nanoscale copper systems consisting of about 200k atoms with the effective-medium theory and molecular dynamics method. Both edge and screw dislocations are [...]
Journal: TechConnect Briefs
Volume: Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Published: April 19, 1999
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9666135-4-6