Knowledge of the atomic-scale structure is an important prerequisite to understand and control the properties of materials. In the case of crystals it is obtained solely from the Bragg peaks in their diffraction pattern and [...]
Parallel lapping is widely employed in destructive physical analysis on semiconductor integrated circuits, to reveal defects isolated by electrical failure analysis tools and techniques. A clean sample surface is critical so that the analysts can [...]
The aim of this paper is a wide investigation of the nano scale of the elastoplastic properties of electroplated Nickel, which is extensively used in the LIGA techniques and polycrystalline hardened and annealed Nickel with [...]
, Burdess J.S.
, Cheung R.
, Enderling S.
, Harris A.J.
, Hedley J.
, Jiang L.
, Mehregany M.
, Ross A.W.S.
, Walton A.J.
, Zorman C.A.
, University of Edinburgh, UK
This paper presents a novel post-fabrication tuning method which changes the resonant frequency of micromechanical beam resonators using Focused Ion Beam (FIB) deposition and removal of platinum. Tuning was achieved by depositing platinum on a [...]
In the present work electrospinning of polycarbonate has been performed to produce nanofibers.Parameters like concentration,voltage,flow rate and distances were varied and an optimum condition of all the parameters was achieved to generate uniform ,smooth nanofibers [...]
Electrospinning is a process by which sub-micron polymer fibers can be produced using an electrostatically driven jet of polymer solution. The fibers are collected as a non-woven mat or membrane with high surface area to [...]
The technique of polymer blending has been used to create new types of polymers with desirable properties in the past decade. Force Modulation Microscopy (FMM) provides a local contrast due to the local elasticity difference [...]
Materials coated with thin-films have become popular in many advanced applications. The thin layer of high-strength coating can improve the performance of the material. However, challenges arise when characterizing or extracting mechanical parameters for this [...]
Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: March 7, 2004
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems