Papers:
Advanced Virtual Qualification Methods to Reduce the Time-to-Market of Microelectronic Assemblies
This work presents some recent progresses in reliability assessment of electronic assemblies in automotive industry and shows how coupled numerical-experimental techniques can help saving time and reducing the cost of IC package qualification. In order [...]
In-situ MEMS Testing
In microsystems technology, new methods in testing and qualification are needed related to the dramatically smaller volume of microelectromecanical systems (MEMS). In single crystal silicon (SCSi) based devices, stress and loading in operation introduces defects [...]
A Novel In-situ Force Measurement Method for Real Solder Joints Fatigue Evaluation
The paper presents a novel thermo-mechanical test method for in-situ force measurement on real solder joints during thermal cycling test. To generate more exact fatigue data for solder joints, a small mechanical machine has been [...]
A Multiscale Modeling Approach for Microelectronic Packaging Applications
With increasing complexity of the systems and ongoing miniaturization, structural dimensions cross over from the micro- to the nanoscale. At this scale, conventional simulation methods are overtaxed: On the one hand, the continuum approach fails [...]
Influence of moisture on humidity sensitive material parameters of microelectonic relevant polymers
This paper presents various modified measurement methods for analysis the effect of moisture of thermo-mechanical properties of MEMS relevant polymer systems. It was developed an advanced measurement method, modified DMA multifrequency and hygroscopic swell analysis, [...]
Advanced In- and Out-off plane High Resolution X-ray Strain Analysis on MEMS
Related to the dramatically smaller volume of microelectromecanical systems (MEMS), new methods in testing and qualification are needed. In single crystal silicon (SCSi) based devices, stress and loading in operation introduces defects during the MEMS [...]
Networking in Micro/Nano Reliability Research Encouraged by EUCEMAN, the European Center for Micro- and Nanoreliability
Based on the conviction that advanced micro and nanotechnologies are continuing to have an ever stronger influence in all spheres of human life and will permeate them even more fully in the future, without, conversely, [...]
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 21, 2010
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 978-1-4398-3402-2