Papers – Page 4 – TechConnect Briefs

Proposal of a router circuit based on nanoelectronic devices

Câmara B.O., Costa J.C., University of Brasilia, BR

An information router in a communication network should deliver data packages from one node to other node. For executing this delivery task efficiently, the router should choose the best path between the nodes. The best [...]

Design of new single-electron information-processing circuit mimicking behavior of swarm of honeybees

Tanabe T., Oya T., Graduate School of Engineering, Yokohama National University, JP

We propose a new single-electron (SE) circuit that shows a unique information-processing by mimicking a foraging behavior of a swarm of honeybees. Recently, a “nature-inspired” or “biomimetic” technique based on natural world phenomena or biological [...]

Fabrication and modeling of resistance switching cells for ReRAM applications

Pawlikiewicz M., Kalkur T.S., University of Colorado Colorado Springs, US

This paper presents the technology, fabrication process, measurements and SPICE-compatible modeling of resistance switching devices. Those devices were built using nickel oxide (NiO) as for oxide layers between two platinum layers that were used as [...]

Semiconductor Equipment Assessment – An Enabler for Production Ready Equipment

Pfeffer M., Bauer A., Fraunhofer Institute for Integrated Systems and Device Technology (IISB), DE

Semiconductor devices today show a ubiquitous presence and are of strategic importance. The manufactured number of transistors per area is still growing along a semi-logarithmic plot over the years. However, Europe‘s position as a supplier [...]

All-printed liquid crystal display devices made from sol-gel Indium tin oxide(ITO) ink

Xia N., Gerhardt R.A., Georgia Institute of Technology, US

Indium tin oxide (ITO) is the most widely used transparent conducting oxide due to its high conductivity and transparency. It is currently used in a wide range of devices that require transparent conducting electrodes. Currently, [...]

Advancements In Ink Jet Technology for Materials Deposition Research and Manufacturing

Buskirk W., Liniger S.D., ImTech Technologies LLC, US

Ink jet technology continues to advance, providing greater opportunities for research, prototyping, and manufacturing. 3D printing continues to evolve, enabling advancements in market segments from medical devices to industrial components. This presentation will provide an [...]

Printed via technology for oxide thin film transistors and inverters

Xie M.L., Wu S.J., Wu X.Z., Chen Z., Wu S.J., Wu X.Z., Cui Z., Suzhou Institute of Nano-Tech and Nano-Bionics,Chinese Academy of Sciences, CN

In recent years, printed electronics starts to evolve from single components to systems where interconnects are essential for transistors to be connected into circuits. For complicated electronic circuits systems such as integrated circuit (IC), multilevel [...]

Thermoelectric temperature sensors by printing with a simple office inkjet printer

Chae H., Jung M., Soum V., Lee J., Kim H., Kim T., Cheong H., Kim H., Kim T., Jeon S., Kwon O-S, Shin K., Sogang University, KR

Recently, printing temperature sensors have been significantly demanded in the paper electronics, such as electronic skin for robots, polymer chain reaction for DNA amplification. Here we present printing thermoelectric temperature sensors by using a simple [...]

Inkjet Printing of High κ-Dielectric Ceramic/Polymer Composite Thick Films

Mikolajek M., Binder J.R., Karlsruhe Institute of Technology (KIT), DE

Inkjet printing offers a high flexibility and therefore is increasingly gaining importance for the selective deposition of functional materials, for example in printed electronics. However, till today either particle based inks or inks based on [...]

Micro Solid Oxide Fuel Cell Fabrication via Inkjet Printing

Hill T.Y., Reitz T.L., Huang H., Air Force Research Laboratory, US

Energy conversion and storage devices (ECSDs) are facing the challenge of manufacturing miniature dimensions and/or unconventional shapes. Furthermore, reducing the total device thickness can significantly reduce the internal resistance and potentially improve interfacial electrochemical kinetics [...]