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Home2015June

Month: June 2015

TechConnect Proceedings Papers

Wearable and flexible electronic devices: Market forecasts 2015-2025

Zervos H., IDTechEx Inc, US
Wearable technology mainly concerns devices and apparel. With a wide range of products, from glasses and other headgear to arm, wrist, leg and footwear, skin patches and even jewelry, the device business is already large, [...]

Room-temperature printing of thin-film devices for flexible electronics

Minari T., Kanehara M., National Institute for Materials Science (NIMS), JP
We have established 'Room-Temperature Printed Electronics (RTPE)' as the new fabrication method for thin-film electronic devices, which can be carried out under ambient atmospheric condition at room temperature without application of heat. Thermal damage is [...]

Engineering nanoinks and photonic manufacturing for printable electronics

Hu A., University of Tennessee, US
We have developed various nanoinks, including silver nanowires, silver nanoplates, Cu-Ag core-shell nanoparticles, graphene oxide and graphene. Gram level nanoplates are successfully synthesized through a polymer controlled hydrothermal growth. Core-shell structures are synthesized through a [...]

Design and Evaluation of a Highly Stretchable and Conductive Thin Film for Tactile Sensors

Sun Y., Zhou D., Bai J., Wang H., Cao J., Univeristy of Minnisota Duluth, US
Keeping good conductivity at high stretching strain is one of the main requirements for the design of flexible electronic devices. The elastic nature of siloxane-based elastomers enables many innovative designs in wearable sensor devices and [...]

Wafer-Scale Planarization using Location Specific Gas Cluster Ion Beam (GCIB) in Advanced CMOS Logic Technology

Moon Y., Qin L., Koli D., Snow C., GlobalFoundries, US
In sub-14nm advanced CMOS logic technology, controlling wafer-scale planarization or uniformity became tremendously critical. This is mainly due to the CMOS integration scheme where chemical mechanical polishing (CMP) is used to create the transistor gate. [...]

Fabrication of highly ordered vertical GaAs nanowires by inductively coupled plasma etching and their modal analysis

Dhindsa N., Chia A., Boulanger J., Khodadad I., LaPierre R., Walia J., Saini S., University of Waterloo, CA
We present highly ordered vertical gallium arsenide (GaAs) nanowires fabricated by dry etching using various metal mask combinations. A great control on the length, diameter, pitch and facet tapering of the nanowires was achieved. Diameters [...]

DNA Double-Write Photolithography: A Synergy for Top-Down and Bottom-Up Nanofabrication

Heller M.J., Song Y., University of California San Diego, US
Intrinsic programmability and other unique properties of DNA allow it to be used as a self-assembly nanostructure material, easily functionalized with nanoparticles and other entities, and as a UV sensitive write material for patterning. Thus, [...]

Key Elements of a Responsible Development Plan for Nanomanufacturing

Hodson L.L., Geraci C.L., National Institute for Occupational Safety and Health, US
Responsible development of nanotechnologies includes considering and managing the potential, unintended consequences to human health and the environment that might accompany development and use of the technology. Key to ensuring the safety of your business, [...]

Near Infrared Sintering of a cost effective Roll to Roll water purification coating

Mabbett I., Brennan D., Lavery N.P., Charbonneau C.M.E., Khan K., Woods R., Pursglove A.B., Bryant D.T., Watson T.M., Worsley D.A., Swansea University, UK
Near Infrared (NIR)at 250kW/m2 has been shown to sinter titanium dioxide on metal based substrates in just 12.5s. This coupled with a screen printable hybrid titania paste with nano-particulate anatase attached to a mesoporous framework [...]

Scalable Polymer Patterning (SP2)

Mead J., Barry C., University of Massachusetts-Lowell, US
Polymeric materials are easily fabricated into a wide array of structures for numerous applications. The bulk properties can be tailored for preparing novel structures and substrates for use as substrates for 3D printing. Particularly, the [...]

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