TechConnect Proceedings Papers
Month: May 2013
Experimental study on sheet resistivity and thickness measurement in Copper Electroplating
Sharma A., Kumar D., Kumar Khandelwal S., Bansal D., Rangra K., Kumar D., Kumar Khandelwal S., Central Electronics Engineering Research Institute (CEERI/ CSIR), IN
Electroplated copper thin films have been extensively used for interconnections in semiconductor devices. In this paper, electroplating of copper has been investigated to study the dependency of plated film thickness, current efficiency and sheet resistivity [...]
In-Situ Assessment of Wafer-Level Hermeticity by Micromembrane Technique
Yang C.-M., Jung H., Park E.M., Park J.H., Park E.M., Park J.H., Kim H-Y, Lee K-R, National Nano FabCenter, KP
Generally, the quantitative hermeticity of Wafer level Vacuum Packaging (WLVP) has been evaluated by integration of pirani gauge vacuum senses. But, this requires complex fabrication process and higher chip cost. In this work, hermeticity and [...]
Fabrication of complex three-dimensional multilevel silicon micro- and nano-structures
We have developed a new process to fabricate arbitrary-shaped, multilevel, three-dimensional free-standing micro- and nano-structures on bulk silicon using focused high energy proton beam irradiation, followed by electrochemical anodization. We make use of the fact [...]
Fabrication of electrical microfluidic chip for electroporation of mammalian cells
The point of this paper is to demonstrate the use of a quick and cheap fabrication method to realize a laser-ablated microfluidic channel for single cell electroporation. Traditional lithography of microchannel with electrode in MEMS [...]
Dual Helix Dielectrophoretic Cell Separator Fabricated Using the Direct-Write Spindle Deposition Technique
Many biomedical procedures necessitating the separation of cells would benefit from the miniaturization of cell separators. This miniaturization effort has led to the development of 2D dielectrophoretic separators. The use of a 3D dielectrophoretic cell [...]
Tungsten for CMOS-MEMS Pirani and Ionization Vacuum Gauges
Tungsten is consider to be the most suitable material for the CMOS-MEMS vacuum gauges, including Pirani vacuum gauge and ionization vacuum gauge, due to its high temperature coefficient, resistant to the electromigration failure, high melting [...]
Contact resistance modeling for NEMS ohmic relays using highly doped SiGe contact material
The principal goal of this work is to develop a more accurate model for the contact resistance using the real surface profile of the contacting material in comparison to the state-of-the art where the surface [...]
Hydrogel-based multi-stimuli responsive cilia
We present large-scale multi-responsive cilia arrays that can be stimulated environmentally (via a pH change), electrically or magnetically. By means of micro-fabrication techniques, we created high-aspect ratio molds on which the polymer solution was cast. [...]
Micro/Nano Patterned Integrated Electrochemical Sensors for Implantable Applications
Electrochemical sensors are very important candidates for many sensing and actuation applications. Micro/Nano scale techniques are very appealing in designing these sensors for completely integrated systems. Such systems can provide accurate and long-term measurements of [...]