TechConnect Briefs
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
Home2002April

Month: April 2002

TechConnect Proceedings Papers

Searching for a New Type of Surface Percolation on a 3D lattice

Tanizawa T., Takano H., Miyazima S., Kochi National College of Technology, JP
We consider a new surface percolation problem on a 3D simple cubic lattice through numerical simulation. In this problem, randomly occupied surfaces initially form an infinite cluster at p = 0.21, where p is the [...]

Ab Initio Simulation on Ideal Shear Strength of Silicon

Umeno Y., Kitamura T., Kyoto University, JP
Single crystal of silicon is commonly used for the substrate of electronic devices. Large stress is induced in the substrate due to thermal mismatch of device component. It is well known that a defect such [...]

Energy-Band Structure of Strained Indirect Gap Semiconductor: A k . p Method

Cavassilas N., Aniel F., Fishman G., CNRS, FR
A strain Hamiltonian Hst, associated with a sps* k.p Hamiltonian Hkp is used to descibe the valence band and the first two conduction bands of a strained indirect semiconductor. Hst takes into accoutn the Bir-Pikus [...]

Phase transition induced hydrodynamic instability

Loh K-K, Saxena A., Lookman T., Parikh A., Los Alamos National Laboratory, US
Instabilities leading to oscillations in some particular properties of a system are intimately related to pattern formation. Nontrivial patterns form spontaneously as a result of the occurrence and propagation of the fronts of instability. These [...]

Ab Initio Molecular Dynamics Simulation on Structure and Strength of Si/Al Interface

Umeno Y., Kitamura T., Kyoto University, JP
It is of great importance to clarify the atomic structure and strength of interfaces between metal and Si substrate in an electronic device. While interaction between atoms near the interface is complicated, ab initio molecular [...]

On the Best Performance of Interacting Agents

Korotkich V., Central Queensland University, AU
Nanotechnology is dependent on harnessing effects of emergent systems, as it relies on the process of taking collections of molecules or individual atoms as building blocks and forming them into useful objects. Emergence can often [...]

Enhanced Structure at the Interface Between the Polymer Matrix and Spherical Nanoparticles in Polymer Based Nanocomposites

Picu R.C., Ozmusul M.S., Rensselaer Polytechnic Institute, US
The effect of a curved solid wall on the conformations of long, flexible polymer chains is studied in a dense polymer system by means of lattice Monte Carlo simulations. The differences with respect to the [...]

Atomic-Level Description of Stress in Dense Polymeric Systems

Picu R.C., Rensselaer Polytechnic Institute, US
A new framework is being developed to describe stress production and relaxation in dnse polymeric systems. Stress is traditionally defined on the molecular scale, with the chaines being regarded as entropic springs. In this view, [...]

FE-Simulation of Fast Switching Behavior of Magnetic Nanoelements

Fidler J., Schrefl T., Forster H., Suess D., Dittrich R., Vienna University of Technology, AT
Numerical micromagnetics is an essential tool to optimize magnetic storage media, spin electronic devices, such as MRAM and microsensors. The application of these devices requires a profound knowledge of the reversal mechanism. In nanostructured magnets [...]

Studies on a DNA Double Helicoidal Structure Immersed in Viscous Bio-Fluid

Lim C.W., Shu J-J, Nanyang Technological University, SG
The paper aims at extending, utilising and generalising research in nonlinear dynamics of (i) spiral/helicoidal structures, and (ii) viscous, low speed fluid to biomechanical DNA fluid-structure interaction. Employing a nonlinear helicoidal model, the energy stored [...]

Posts pagination

« 1 2 3 4 … 32 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.