Sensors, MEMS, Electronics – Page 393

Linking of Atomistic Modeling to Macroscopic Behavior for Front End Processes

Dunham S.T., Boston University, US

In this work, we review efforts to make effective use of atomistic calculations for the advancement of VLSI process simulation. We focus on front-end processes such as defect mediated dopant diffusion which play a large [...]

Implant and Diffusion Modeling

CAD Analyses of PCR Well Containment

Deshpande M., Greiner K.B., Romanowicz B.F., Gilbert J.R., Microcosm Technologies, Inc., US

Design analysis of PCR (Polymerase Chain Reaction) microwells are conducted to observe the contamination between neighboring wells on a PCR chip during the reaction. Thermal effects are incorporated to represent the temperature cycling characteristic of [...]

Web-Based Design Tools for MEMS-Process Configuration

Hahn K., Brück R., University of Siegen, DE

The micro electromechanical systems (MEMS) industry is characterized by small and medium sized enterprises (SMEs) specialized on products to solve problems in specific domains like medicine, automotive sensor technology, etc. In this field of business [...]

SUNRED: A Field Solver and Compact Model Generator Tool Based on Successive Node Reduction

Székely V., Páhi A., Rosenthal M., Rencz M., Techical Unviersity of Budapest, HU

The paper presents the new features of the SUNRED field solver program: the visualization of the structures in the 3D version, and the new dynamic simulation methods. Comparisons with other field solvers demonstrate the superior [...]

Modeling of Stress Induced Hysteresis in Piezo-Resistive Analysis

Lien H-P, ISE, CH

The impact of mechanical stress on electrical characterizations of microelectronic circuitry is a major design issue in development of sensors and integrated micro-electro-mechanical systems. Because the electrical properties of semiconductors are in uenced by external [...]

Software Tools, CAD Systems

Optimal Time Stepping in the Thermo-mechanical Finite Element Simulation of IGBTs Modules

Tronel Y., Fichtner W., ETH Zürich, CH

In the analysis of the thermo-mechanical response of the wire bond connection found e.g in IGBTs modules, it has been found that the level of stresses are within the plastic range [1]. Therefore an incremental [...]

Analysis of Unstable Behavior Occurring in Electro-Mechanical Microdevices

König E-R, Wachutka G., Münich University of Technology, DE

We analyze the instability which is inherent to electrostatically driven microdevices. Further, we propose a homotopy method to overcome this difficulty during simulation of these devices. Starting from a simplified model, the governing differential equations [...]

Optimum Algorithm for Electronic System Design

Zemliak A., Puebla Autonomous University, MX

The evaluation of operations number for the system design has been done for general design strategy. More general methodology for the system and circuit design was elaborated by means of optimum control theory formulation. This [...]