TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeSectorsSensors, MEMS, Electronics

Sector: Sensors, MEMS, Electronics

MEMS & NEMS Devices, Modeling & Applications

Low transmission loss flexible substrates using low Dk/Df polyimide adhesives

Tasaki T., Arakawa Chemical Industries, Ltd., JP
To meet the ever-increasing requirements of transmission data with a growth in the market for information technology gadgets such as mobile phones, the transmission frequency of circuits is increased. However, the integrity of high-frequency signals [...]

XTPL Approach to Print Submicron Conductive Lines on Dielectric Substrates

Kowalczewski P., Wiatrowska A., Dusza M., Zięba M., Cichoń P., Fijak K., Granek F., XTPL SA, PL
The concepts of printed electronics offer a tremendous potential when brought to nanotechnology. We present a novel technology for printing submicron conductive lines at unprecedented flexibility, accuracy, and low cost. The lines with resistivity down [...]

A Stretching/Bending-Insensitive Flexible Pressure Sensor with Carbon Nanotube-PDMS

Zhang R., Stevens Institute of Technology, US
Flexible pressure sensors have many successful applications in personal electronic devices, artificially intelligence, and industrial production applications [1]. Despite the good performance and high flexibility, the measurement of pressure under dynamic deformation has remained difficult [...]

Printed & Flexible Electronics

Self-assembly via a quantum control tracking system

Kohn W., Zabinsky Z., Nerode A., Veritone, US
A nano-manufacturing facility requires high levels of precision due to the strong quantum effects for devices at a 2 to 4 nanometer footprint. We develop a feedback process control to realize a 3-D scaffolding approach. [...]

European Activity for Smart Power Electronics and Power Discretes – The R3-PowerUP EU Project

Bieniek T., Janczyk G., Instytut Technologii Elektronowej, PL
Smart power ICs are key enabling components for various applications from mid-power automotive, to industrial power, battery management systems electric vehicles, domotics, indoor and outdoor lighting, computers and industrial peripherals. Power electronics serves over 30% [...]

The Multifunctional 3D Interposer Platform for HPC – Development, Measurements, Design Guidelines

Janczyk G., Bieniek T., Instytut Technologii Elektronowej, PL
This paper presents dedicated solutions developed in frame of the EU FP7 CarrICool project focused on the modular interposer system architecture providing scalable heat removal, local power delivery and optical signaling issues critical for high [...]

A molecular dynamics study of the causes of defects at dielectric/substrate interface of Ge MOSFETs

Heydari A., Sheikholeslam S.A., Grecu C., Ivanov A., University of British Columbia, CA
The superior electrical properties of Germanium (Ge), such as higher electron and hole mobility, compared to that of other semiconductor materials, have been one of the factors to cause germanium to return to be of [...]

Development of “fullerene composite paper” for aiming to fabricate electronic paper devices

Onishi T., Oya T., Yokohama National University, JP
We propose a new functional paper containing fullerenes, i.e., a “fullerene-composite paper.” Generally, a fullerene, C60, has the form of a hollow sphere by carbon. It is known that the fullerenes have high physical and [...]

Posts pagination

« 1 … 9 10 11 … 414 »

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.