TechConnect Proceedings Papers
Reliability Evaluation of Inkjet-Printed Silver Patterns for Application to Printed Circuit Board
Shin K.-Y., Kang H.S., Kang K.T., Kang H.S., Kang K.T., Hwang J.Y., Lee S-H., Kim J-M, Korea Institute of Industrial Technology, KR
Recently, several studies on the reliability of inkjet-printed patterns have been conducted to evaluate inkjet printing technology as a fabrication process for the printed circuit board industry. However, the methods and standards for evaluating the [...]