Reliability Evaluation of Inkjet-Printed Silver Patterns for Application to Printed Circuit Board

, , , , , , ,

Keywords: , , ,

Recently, several studies on the reliability of inkjet-printed patterns have been conducted to evaluate inkjet printing technology as a fabrication process for the printed circuit board industry. However, the methods and standards for evaluating the reliability of inkjet-printed patterns have not yet been entirely established. In this study, we describe the analysis of inkjet-printed silver patterns on epoxy-coated substrates according to several reliability evaluation test method guidelines for conventional PCB. To prepare patterns for the reliability analysis, various regular test patterns were created by Ag inkjet printing on flame retardant 4 and polyimide substrates coated with epoxy for each test method. We coated the substrates with an epoxy primer layer to control the surface energy during printing of the patterns. The contact angle of the ink to the coated epoxy primer was 69 o, and its surface energy was 18.6 mJ/m2. Also, the substrate temperature was set at 70 oC. We were able to obtain continuous line patterns by inkjet printing with a droplet spacing of 60 ㎛. The reliability evaluation tests included the dielectric withstanding voltage, adhesive strength, thermal shock, pressure cooker, bending, uniformity of line-width and spacing, and high-frequency transmission loss tests.

PDF of paper:

Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2014: MEMS, Fluidics, Bio Systems, Medical, Computational & Photonics
Published: June 15, 2014
Pages: 153 - 156
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topic: Inkjet Design, Materials & Fabrication
ISBN: 978-1-4822-5827-1