Janczyk G., Bieniek T.
Instytut Technologii Elektronowej, PL
Keywords: accelerated interconnect ageing, ATMA method, reliability evaluation
Many complex chips and novel smart nanosensor systems are developed as 3D structures like SiP on SoC to implement all requested functionality and achieve performance. Such structures incorporate several modules, materials forming 3D setup which can no longer be considered as pure electrical system. Is has to be treated as a complex micro-electro-mechanical system with strong thermal feedback introducing inner-mechanical stress and lowering reliability of the device. Selected reliability issues to be considered cover various types of defects: scratches, displacements, delamination, fractures, fatigue cracking, void formation etc…This paper focuses on this innovative method of defect generation, introduction and ageing results evaluation. Tested interconnection structures have been developed as a set of MEMS-based cantilever beams called AABS with alumina and other material strips exposed to periodic deformation by mechanical vibration of the microcantilever. This paper is a research report presenting current status of work covering discussion of a specimen implementation, measurement setup fabricated in 3 dozen of samples, intermediate measurement results and plans for future research works
Journal: TechConnect Briefs
Volume: 3, Nanotechnology 2014: Electronics, Manufacturing, Environment, Energy & Water
Published: June 15, 2014
Pages: 257 - 260
Industry sectors: Advanced Materials & Manufacturing | Energy & Sustainability
Topic: Sustainable Materials
ISBN: 978-1-4822-5830-1