Yamaguchi M., Ueno S., Miura I., Erikawa W.
Technical Research Institute Japan Society for the promotion of machine industry, JP
Keywords: confocal laser scanning microscopy, MEMS, Raman spectroscopy, reliability
In this study, we demonstrate mechanical stress and shape profile measurements using confocal laser scanning microscopy (CLM) interface for Raman spectroscopy and that this system is reasonable and helpful to the MEMS designer. By combining with a micro-Raman spectroscope, not only shape measurement but also mechanical stress analysis in the same observation area can be performed by CLM.
To show the potential of this system for the characterization of MEMS device, the Si membrane of a pressure sensor was measured. Measurements were performed on the top side of membrane in no- and under-pressure. Tensile stress in the center of the membrane and compressive stress near the edge are clearly found. We can clearly find the relationship bending shape and mechanical stress in a small scale MEMS devices.
Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, Volume 1
Published: May 7, 2006
Pages: 804 - 807
Industry sector: Advanced Materials & Manufacturing
Topic: Materials Characterization & Imaging
ISBN: 0-9767985-6-5