In this paper, a detailed simulation-based characterization of QCA defects and study of their effects at logic-level are presented. Different defect mechanisms for QCA active devices and interconnects are considered and the appropriate fault models at logic-level are investigated. Different implementations of QCA logic devices and interconnects are compared in term of defect tolerance and testability.
Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: March 7, 2004
Pages: 190 - 193
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics