Bouche G., Gonella R., Sabouret E.
Technology Modeling STMicroelectronics, FR
Keywords: bonding pad, compression test, mechanical stress, reli-ability, simulation
Introducing new intermetal materials, with improved electrical properties but lowered mechanical resistance, requires in terms of reliability to design new structures for pads. The test structures under fabrication have been simulated to try and evaluate the state of stress under various loads in the structures: the analysis of the results aims at supporting the choice of a specific type of structure and optimizing the parameters of this structure. The present work will help analyze further experimental data under compressive stress.
Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2001 International Conference on Modeling and Simulation of Microsystems
Published: March 19, 2001
Pages: 442 - 445
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9708275-0-4