Application of YAG Laser Micro-Welding in MEMS Packaging


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This paper reports a new packaging method for a wide range of MEMS for application on both the wafer and device scale. We show a complete set of experimental and modeling results for the application of a millisecond pulse laser utilizing a titanium package.Unlike current packaging methods which require several high temperature steps and global heating, this proposed packaging method generates a localized heating source which accommodates temperature sensitive MEMS devices. This paper introduces titanium as an advantageous MEMS packaging material due to its high fracture toughness, weldability and potential serving in vivo applications for Biotechnology.

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Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 21, 2010
Pages: 5 - 8
Industry sector: Sensors, MEMS, Electronics
Topic: Nanoelectronics
ISBN: 978-1-4398-3402-2