packaging – TechConnect Briefs

Nanostructured Calcium Silicate Phase Change Materials for Thermal Buffering in Packaging and Construction Applications

Johnston J.H., Victoria University of Wellington, NZ

This paper presents the formation and use of a novel composite nanostructured calcium silicate phase change material with significant thermal buffering capacity for use in thermally responsive packaging and construction materials. Phase change materials (PCMs) [...]

Electrochemical Production of Hydrocarbons for Lubricants, Waxes and Fuels from Biological Feedstocks

Joshi C., Malevich D., Dambacher J., Lockwood F., Altranex Corporation, CA

Altranex Corporation produces hydrocarbons from biologically-derived fats, oils and greases. Through a patented combination of electro- and thermo-chemical processes, Altranex can produce hydrocarbons for use as high-performance lubricant base oils, cosmetic-quality waxes and mineral oils, [...]

Advanced Packaging for Next Generation Imaging and Sensor Devices

Kulick J., Indiana Integrated Circuits, LLC, US

Quilt Packaging is a unique and versatile edge-interconnect technology that utilizes “nodule” structures that extend out from the vertical facets along the edges of chips to allow for inter-chip communication. QP has demonstrated world-record chip-to-chip [...]

Nanoparticle Release from Polymer Nanocomposites Used for Potable Water Infrastructure and Food Packaging: Current Progress & Beyond

Whelton A.J., Duncan T.V., Koontz J.L., Nguyen T., University of South Alabama, US

Engineered nanoparticles (ENP) are increasingly being integrated into polymeric infrastructure and food packaging materials worldwide. ENPs can improve product strength, extend infrastructure service life, and increase a polymer’s antimicrobial resistance and oxygen barrier properties. While [...]

Investigation of Lead-free Nanosolder Reflow and Wettability Property for Electronics/Nanoelectronics Assembly and Packaging

Gao F., Gu Z., Shina S., Morose G., Eliason P., Farrell R., University of Massachusetts-Lowell, US

The current demand for high-performance interconnects in advanced packaging is resulting in dramatic scaling down of the electronics packaging feature size from microscale to nanoscale. Novel and/or enhanced interconnection and packaging techniques have to be [...]

Application of YAG Laser Micro-Welding in MEMS Packaging

Bozorgi P., university of california, santa barbara, US

This paper reports a new packaging method for a wide range of MEMS for application on both the wafer and device scale. We show a complete set of experimental and modeling results for the application [...]

Contact-free Handling of Metallic Submicron and Nanowires for Microelectronic Packaging Applications

Fiedler S., Zwanzig M., Jäger M.S., Böttcher M., Fraunhofer Institute for Reliability and Microintegration, DE

Individual submicron particles produced by non-lithographic techniques can be attractive for future microelectronic applications. Their touchless manipulation is a necessary prerequisite to use them, since they are too small to be handled via Pick&Place. We [...]

Micro to Nano – Scaling Packaging Technologies for Future Microsystems

Braun T., Becker K.-F., Bauer J., Hausel F., Pahl B., Wittler O., Mrossko R., Jung E., Ostmann A., Koch M., Bader V., Minge C., Aschenbrenner R., Reichl H., Technical University Berlin, DE

As the development of microelectronics is still driving towards further miniaturization new materials, processes and technologies are crucial for the realization of future cost effective microsystems and components. These future systems will not only consist [...]

High bending stiffness paperboard laminates with reduced weight

Jogikalmath G., Reis L., Soane D., NanoPaper LLC, US

High bending stiffness is desirable in many paper and paperboard applications. This property is often achieved by manufacturing dense, high caliper sheets or boards. In addition to consuming large amounts of pulp, such paperboards or [...]

Bonding Pad with Reduced Capacity

Mats I., Tarcenco V., Select Techno-Fix Ltd, CA

The technical solutions for the Integrated Circuits (ICs) packaging remains enough conservative during microelectronics development. The ICs with active components having size of micrometers or even nanometers continue to have bonding pads area within hundreds [...]