thin film – Page 4 – TechConnect Briefs

Field Emission of Nanostructured AlQ3 Amorphous Film and the Heat Treatment Effect

Cho C-P, Perng T.P., National Tsing Hua University, TW

There has been a particular interest in tris-(8-hydroxyquinoline) aluminum (AlQ3)-based devices for the development of large-area displays due to the unique properties such as excellent flexibility, high photoconductivity, and nonlinear optical behavior. It is then [...]

Multiscale Modeling of Self-Organized Mono-layer Surface Atomic Clusters

Hu Q., Ghoniem N.M., Walgraef D., University of California, Los Angeles, US

We present here a novel multiscale modeling approach to investigate the conditions for atomic cluster self-organization on atomically flat substrates during epitaxy deposition processes. A phase field model is developed for the free energy of [...]

Mechanical Parameter Extraction of Thin-Film Coated Materials

Li Y., Tseng K.K., Vanderbilt University, US

Materials coated with thin-films have become popular in many advanced applications. The thin layer of high-strength coating can improve the performance of the material. However, challenges arise when characterizing or extracting mechanical parameters for this [...]

Thin Film Instability and Nanostructure Formation: a Molecular Dynamics Study

Han M., Lee J.S., Park S., Choi Y.K., Seoul National University, KR

One of the recent studies showed that the structures can be self-constructed by controlling the instability of thin fluid film of a nano-scale [S.Y. Chou and L. Zhuang, , J. Vac. Sci. and Technol. B, [...]

Multivariant Measurements for Thin Film Adhesion as a Function of Temperature and Thin Film Thickness

Chiang M., Song R., Karim A., Amis E.J., National Institute of Standards and Technology, US

The progress of a proposed high-throughput combinatorial approach to the edge delamination test is reported. This approach can construct the adhesion reliability, as a function of temperature and film thickness (in the sub-micron range) in [...]

Modular Silicon Micropump

Johnson A.D., Martynov V., Gupta V., Menchaca L., TiNi Alloy Company, US

A new micropump mechanism has been created that consists of two silicon/silicon oxide dies with vias and dome-shaped membranes. The membranes are bonded face-to-face to form variable-volume domed liquid chambers. The membranes increase and decrease [...]

Keywords: thin film