nanowires – TechConnect Briefs

Effects of III-V Semiconductor Nanowires on Human Lung Cancer Cells

Abariute L., Prinz C.N., Lund University, SE

Nanotechnology empowers existing technologies and enriches the effectiveness of new applications. One of the great examples are III-V semiconductor nanowires (NW), which have a broad application range, from electronics and energy-conversion to biological applications [1]. [...]

From Self-assembled Brominated Diphenylacetylene Molecules to On-surface Organic Nanowires

Sedona F., Seyyed Fakhrabadi M.M., Sambi M., Università Degli Studi di Padova, IT

Fabrication of nanomaterials is one of the pivotal challenges that researchers endeavor to find novel techniques for them. Due to the inherent and practical limitations of top-down techniques frequently applied to fabricate nanosystems, scientists try [...]

Intense Pulsed Light Sintering and Reduction of Facile Copper Hydroxide Synthesis towards Printable Copper Contacts

Druffel T., Dharmadasa R., Draper G., University of Louisville, US

The printed electronics market is a rapidly growing field, with the market set to reach $3.6B by 2018. Conductive inks are used in a vast variety of technologies. Inks are typically composed of metallic particles [...]

Photothermal Structural and Optical Changes In GaAs Nanowires

Walia J., Dhindsa N., Flannery J., LaPierre R., Forrest J., Saini S.S., University of Waterloo, CA

The structural and optical changes in vertically etched GaAs nanowires are examined. The nanowires were annealed via photo-thermal conversion, using 100 mW of incident laser power, to induce the onset of arsenic formation. Four nanowire [...]

Heterogeneous Nano-electronic Devices Enabled by Monolithic Integration of IIIV, Ge, and Si to expand future CMOS functionality

Thean A.V-Y., Collaert N., Waldron N., Merckling C., Witters L., Loo R., Mitard J., Rooyackers R., Vandooren A., Verhulst A., Veloso A., Pourghaderi A., Eneman G., Yakimets D., Huynh Bao T., Garcia Bardon M., Ryckaert J., Dehan M., Wambacq P., Caymax M., IMEC, BE

3D-IC’s by stacking and connecting dies of different functions with through-silicon via processes are emerging as an upcoming heterogeneous SOC enabler. Since connectivity between stacked layers may be limited by nearest-neighbor layers, the stagnation of [...]

Enhancement in optical and electrical efficiency of a Si nanocrystal light-emitting diode by indium tin oxide nanowires

Huh C., Kim S-H, Kim T.-Y., Park B.-J., Jang E.-H., Kim S-H, Kim T.-Y., Electronics and Telecommunications Research Institute, KR

In this work, a new technique for improving the optical and electrical properties of Si NC LEDs by employing indium tin oxide (ITO) nanowires (NWs) was investigated. The structure of Si NC LED investigated here [...]

Synthesis and Characterization of a Novel Palladium Nanostructured Ensemble Supported in Anodized Alumina Membranes for Hydrogen Sensing Applications

Méndez-Colberg H.G., Martínez-Iñesta M.M., University of Puerto Rico, Mayaguez Campus, US

A Pd/Anodic alumina membrane (AAM) ensemble was formed by using Solid State Reduction. The ensemble consisted of Pd thin films on both sides of the AAM with connecting nanowires as evidenced with Scanning Electron Microscopy [...]

Structural Color Generation in Silicon Nanowires Enable Low-Cost Refractive Index Sensors

Walia J., Khorasaninejad M., Dhindsa N., Saini S.S., University of Waterloo, CA

Structural colors are generated using waveguiding and diffractive effects in ordered silicon nanowire arrays. Tunable colors can be achieved by changing the angle of incidence. The generated colors are used for refractive index sensors with [...]

A nanoscale machine shop for NWs

Cheng G.J., Li Ji, Purdue University, US

One-dimensional nanomaterials have attracted a great deal of research interest in the past few decades due to their unique mechanical, electrical and optical properties. Changing the shape of nanowires (NWs) is both challenging and crucial [...]

Investigation of Lead-free Nanosolder Reflow and Wettability Property for Electronics/Nanoelectronics Assembly and Packaging

Gao F., Gu Z., Shina S., Morose G., Eliason P., Farrell R., University of Massachusetts-Lowell, US

The current demand for high-performance interconnects in advanced packaging is resulting in dramatic scaling down of the electronics packaging feature size from microscale to nanoscale. Novel and/or enhanced interconnection and packaging techniques have to be [...]