mechanical stress – TechConnect Briefs

Bonding Pad Resistance. A Combined Approach

Bouche G., Gonella R., Sabouret E., Technology Modeling STMicroelectronics, FR

Introducing new intermetal materials, with improved electrical properties but lowered mechanical resistance, requires in terms of reliability to design new structures for pads. The test structures under fabrication have been simulated to try and evaluate [...]

Moment-based Analysis of Mechanical Effects on Trench-Hall Devices

Taschini S., Korvink J.G., Baltes H., ETH Zürich, CH

This paper presents a novel method for the assessment of mechanical effects on trench-Hall devices based on a moment expansion combined with two-dimensional finite-element discretization. Analogously to plate theories, a truncated moment expansion of the [...]