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HomeKeywordsFEA

Keywords: FEA

New Accurate 3-D Finite Element Technology for Solving Geometrically Complex Coupled-Field Problems

Avdeev I., Gyimesi M., Lovell M., Ostergaard D., University of Pittsburgh, US
Increased functionality of microelectromechanical systems (MEMS) has lead to the development of micro-scale devices that are geometrically complex. These complex configurations require the development of new and more efficient finite element (FE) techniques for modeling [...]

Study of Misaligned Lateral Combdrive Static Actuators

Avdeev I., Lovell M., Onipede Jr. D., University of Pittsburgh, US
In-plane combdrive misalignments are studied using developed analytical and numerical (FEA) models and techniques. Issues of decreasing precision and stability are discussed. The analytical models are closed form and can be used by designers of [...]

Modeling and Simulation of A Surface Micromachined Triaxial Accelerometer

Jiang L., Carr W.N., New Jersey Institute of Technology, US
We present the modeling and simulation results in designing a surface micromachined, capacitive triaxial accelerometer. Electrical FEA simulations calculate the nominal values of the sensing capacitors and compared with parallel-plate analytical model. The mechanical static [...]

Comparative Studies of Novel Capacitive Transducers with Non-Planar Diaphragms

Chen J., Liu L., Li Z., Liu L., Tsinghua University, CN
Novel single-chip fabricated condenser structures with corrugated diaphragms for residual stress releasing have been proposed and simulated. An electrostatic-structural coupling FEM analysis has been performed to fully reveal the nonlinear relationship of output electrical signal [...]

Simulation and Characterization of High Q Microresonators Fabricated by UV – LIGA

Basrour S., Majjad H., Coudevylle J.R., Coudevylle J.R., de Labachèlerie M., CNRS, FR
This paper is devoted to a study on a new metallic microresonator realized by UV-LIGA technique. This device is excited electrostatically and takes advantage of the contour modes or Lamé-modes of the structure. Design methods [...]

Simulation and Experimental Verification of Micro Polymerase Chain Reaction Chip

Lin Y-C., Yang C-C., Hwang M-Y., Chang Y-T., Cheng Kung University, TW
This study used finite element analysis to simulate the temperature characteristics of a micro polymerase chain reaction (PCR) chip. The micro-PCR chip was fabricated on a silicon wafer and Pyrex glass using photolithography, wet etching, [...]

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