Eutectic bonding – TechConnect Briefs

In-Situ Assessment of Wafer-Level Hermeticity by Micromembrane Technique

Yang C.-M., Jung H., Park E.M., Park J.H., Park E.M., Park J.H., Kim H-Y, Lee K-R, National Nano FabCenter, KP

Generally, the quantitative hermeticity of Wafer level Vacuum Packaging (WLVP) has been evaluated by integration of pirani gauge vacuum senses. But, this requires complex fabrication process and higher chip cost. In this work, hermeticity and [...]

High Resolution Silicon Accelerometer Using Eutectic Bonding

Kwang Y., Yeon J.C., Kim Y.H., Rhee S.W., Oh S.H., Seoul National University, KR

High precision micro-accelerometers are used in many applications such as automotives, aviations and aerospace navigation systems. In this paper, a lateral capacitive micro-accelerometer with _g level resolution has been designed and fabricated using simple micromachining [...]