dielectrics – TechConnect Briefs

Inkjet Printing of High κ-Dielectric Ceramic/Polymer Composite Thick Films

Mikolajek M., Binder J.R., Karlsruhe Institute of Technology (KIT), DE

Inkjet printing offers a high flexibility and therefore is increasingly gaining importance for the selective deposition of functional materials, for example in printed electronics. However, till today either particle based inks or inks based on [...]

Dielectric performance of Polymer Nanocomposites Synthesized by Atmospheric-pressure Plasma-treated Silica Nanoparticles

Yan W., University of New South Wales, AU

The incorporation of nanoparticles can effectively enhance the dielectric performance of polymers. However, the organic-inorganic incompatibility prevents the nanocomposites from obtaining the desired properties. To overcome this issue, coupling agents have been used to coat [...]

Overview of Polymer Nanocomposites as Dielectrics and Electrical Insulation Materials for Large High Voltage Rotating Machines

Han J., Garrett R., Siemens Power Generation, US

Polymer nanocomposites are defined as polymers in which small amounts of nanometer size filers are homogeneously dispersed. In power industry, electrical insulating polymers usually incorporate inorganic fillers to achieve specific electrical, mechanical, thermal properties and [...]

Scaling Relation for the Size Dependence of Acoustic, Dielectronic and Photonic Behaviour of Nanosolid Silicon

Sun C.Q., Pan L.K., Li C.M., School EEE, NTU, Singapore, SG

Structural miniaturization provides us with a new freedom that is indeed fascinating. The new freedom of size not only allows us to tune the physical and chemical properties of a specimen by simply adjusting the [...]

Capacitance Extraction from Complex 3D Interconnect Structures

Cartwright D., Csanak G., George D., Walker R., Kuprat A., Dengi A., Grobman W., Los Alamos National Laboratory, US

A new tool has been developed for calculating the capacitance matrix for complex 3D interconnect structures involving multiple layers of irregularly shaped interconnect, imbedded in different dielectric materials. This method utilizes a new 3D adaptive [...]