copper – Page 3 – TechConnect Briefs

Melting of Ultrathin Copper Nanobridges

Kang J-W, Hwang H-J., Chung-Ang University, KR

The previous studies on nanoclusters and infinite nanowires have shown the physical phenomena related to only the melting of nanoclusters and nanowires. This study showed the various physical phenomena of ultrathin nanobridges, such as the [...]

Fabrication of Self Organized Copper Nanostructures on Structureless Surfaces

Kunz R., Kipp L., Skibowski M., Adelung R., Christian-Albrechts-University, DE

An easy way to cover large areas with nano-or microstructures is self-organization. Against intuition, we claim that structureless crystals in terms of surface features are well suitable for self organized structuring on the nano-and micrometer [...]

Growth of Copper on Ag(100) at Experimental Deposition Rates Using TAD

Sprague J., Montalenti F., Voter A.F., Naval Research Laboratory, US

The initial stages of growth of (001) Cu films on (001) Ag substrates have been investigated using the temperature accelerated dynamics (TAD) method. The acceleration provided by this method made it possible to simulate the [...]

Pre-Physical Design Analysis and Optimization of Repeaters Based on Technology Node, Materials, Devices, and Repeater Options

Lynch W.T., Independent Consultant, US

For the first time a comprehensive methodology has been applied to the pre-physical design of hierarchical interconnect wiring with consideration of the limitations of both the device and the wiring technologies (Fig. 1). The overall [...]

Strength of Nanoscale Copper Connection Under Shear

Heino P., Tampere University of Technology, FI

Strength and shear modulus of several polycrystalline copper systems were calculated with the molecular dynamics method and effective-medium potential. Grain size varied between 2{10nm and systems were sheared beyond the yield point at room temperature. [...]

Molecular Dynamics Study of Thermally Induced Shear Strain in Nanoscale Copper

Heino P., Ristolainen E., Tampere University of Technology, FI

We study the effects of thermally induced shear strain and stress in several nanoscale copper systems consisting of about 200k atoms with the effective-medium theory and molecular dynamics method. Both edge and screw dislocations are [...]