Squeeze Film Damping in Arbitrary Shaped Microdevices Modelled by an Accurate Mixed Level Scheme

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We propose a mixed level simulation scheme for squeeze film damping (SQFD) effects in microdevices, which allows for including the damping effects in system-level models of entire microsystems in a natural physical-based way. It also provides very large flexibility with respect to device geometry and the constituent components of a microsystem. The proposed damping model is realized in VHDL-AMS and can be easily included in system level models for full system simulation. The method has been successfully demonstrated for ele-mentary micromechanical structures. The results from the mixed level simulation approach conform very well with 3D-Navier-Stokes-based FEM simulations showing the applicability of our methodology.

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Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2001 International Conference on Modeling and Simulation of Microsystems
Published: March 19, 2001
Pages: 92 - 95
Industry sector: Sensors, MEMS, Electronics
Topics: Modeling & Simulation of Microsystems
ISBN: 0-9708275-0-4