TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeAuthorsSchenk H.

Authors: Schenk H.

Stress Optimization of a Micromechanical Torsional Spring

Klose T., Kunze D., Sandner T., Schenk H., Lakner H., Schneider A., Schneider P., Schneider A., Schneider P., Fraunhofer IPMS, DE
In this paper we present a method for the design of a stress-optimized, micromechanical torsional spring, used in MEMS. Our optimization approach is based on a software tool for simulator-based optimization MOSCITO, cooperating with the [...]

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.