TechConnect Briefs
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeAuthorsLienemann J.

Authors: Lienemann J.

MEMS Compact Modeling Meets Model Order Reduction: Examples of the Application of Arnoldi Methods to Microsystem Devices

Billger D., Greiner A., Korvink J.G., Lienemann J., Rudnyi E.B., IMTEK, Albert Ludwig University, DE
Modeling and simulation of the behavior of a system consisting of many single devices is an essential requirement for the reduction of design cycles in the development of microsystem applications. Analytic solutions for the describing [...]

mor4ansys: Generating Compact Models Directly From ANSYS Models

Greiner A., Korvink J.G., Lienemann J., Rudnyi E.B., IMTEK, Albert Ludwig University, DE
Model reduction of linear large-scale dynamic systems is already quite an established area [1]–[3]. In a number of papers (see references in [3]), the advantages of model reduction have been demonstrated. In the present paper, [...]

Electrode Shapes for Electrowetting Arrays

Greiner A., Korvink J.G., Lienemann J., Albert Ludwig University, DE
We calculate the potential energy of an electrowetting array for different shapes and sizes of interdigital edge structures. To understand the dynamic effects at the beginning of the droplet motion is crucial for the optimization [...]

Capillary Forces in Micro-Fluidic Self-Assembly

Böhringer K.F., Greiner A., Hanein Y., Korvink J.G., Lienemann J., Xiong X., IMTEK, Albert Ludwig University, DE
Parallel self-assembly in the fluidic phase is a promising alternative technique to conventional pick-and-place assembly. In this work the hydrophobic-hydrophilic material system between binding sites for microparts is simulated with respect to alignment precision. The [...]

Optimization of Integrated Magnetic Field Sensors

Greiner A., Korvink J.G., Lienemann J., Sigmund O., Albert Ludwig University, DE
We present an optimization strategy for the offset reduction of integrated magnetic field sensors with simultaneous maximization of sensitivity. We use the topology optimization method to automatically find a design with maximal sensitivity for given [...]

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 14-16, 2021 • Austin, TX

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
  • Sitemap
  • Contact

Copyright © TechConnect | All rights reserved.