Kulha P. – TechConnect Briefs

The Design of Temperature Matrix with Direction Sensitivity

Husak M., Jakovenko J., Kulha P., Janicek V., Czech Technical University in Prague, CZ

There has been designed a matrix of four temperature sensors on a chip. Each temperature sensor is composed of 9 NMOS transistors for increasing temperature sensitivity. The matrix is designed for anemometric measurement of velocity [...]

Macromodel of Intelligent Sensor Structure with Accelometer

Husak M., Jakovenko J., Kulha P., Novak J., Janicek V., Czech Technical University in Prague, CZ

The paper describes conceptual approach to the design of a tilt structure determined for integration on a chip. An accelerometer for measurement of inclination in x and y axes is used as a sensor. There [...]

Modelling and Simulation of Mechanical, Thermal and Electrical Behaviour of Si Cantilever with Implanted Strain Gauge

Husak M., Jakovenko J., Kulha P., Vborn Z., Czech Technical University in Prague, CZ

The paper describes methodology of design of cantilever with implanted layers in Si monocrystal. In the paper there is characterized physical model of implanted strain gauges, various girder topologies are designed and basic technological steps [...]