3-D Thermal Simulator Dedicated for Modern Silicon Structures
Zubert M., Raszkowski T., Janicki M., Samson A., Jankowski M., Napieralski A., Lodz University of Technology, PL
The accurate thermal modelling of nanoscale chips is of vital importance, as heat dissipation is arguably one of the most important problems in modern integrated circuits. As the technology node is expected to continue to [...]