TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeAuthorsDing C.

Authors: Ding C.

Tunable Wetting of Titanium and Gold Based Wicking Materials

Ding C., university of california, santa barbara, US
We quantitatively report the experimental super-wetting results of wicking materials fabricated with bulk titanium micromachining, nano-scale surface modification and gold plating techniques. The results show all the four samples are completely wettable with water but [...]

Wicking Study of Nanostructured Titania Surfaces for Flat Heat Pipes

Ding C., Bogorzi P., Sigurdson M., Soni G., Meinhart C., MacDonald N.C., university of california, santa barbara, US
We report a wicking material based on nanostructured TiO2 (NST) for the application of flat heat pipes. This wicking material is formed by oxidizing Ti pillar structures in H2O2 solution. The NST surfaces shows nano-scale [...]

Nanocomposite Contact Material for MEMS Switches

Ding C., MacDonald N.C., university of california, santa barbara, US
This work reports the development of a nanostructured composite contact material for improving the contact reliability of MEMS switches. The nanocomposite material was integrated into a bulk titanium MEMS (BT-MEMS) switch which was fabricated using [...]

Bulk-Titanium Waveguide – a New Building Block for Microwave Planar Circuits

Huang X.T., Todd S., Ding C., MacDonald N.C., University of California at Santa Barbara, US
We present a new topology for planar microwave transmission line: bulk titanium waveguide. The waveguide is formed by deep trench etching, dielectric gap filling, and planarization. The high aspect ratio of the resulting structure provide [...]

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.