Copper Displacement Deposition on Nanostructured Porous Silicon
Bandarenka H., Redko S., Nenzi P., Balucani M., Belarusian State University of Informatics and Radioelectronics, BY
In the present work we have demonstrated nanosized structures fabrication by the copper displacement deposition on electrochemically etched porous silicon. Peculiarity of such method is the convergence of copper reduction with porous silicon dissolution. Principal [...]