US – Page 464 – TechConnect Briefs

Heterogeneous Thin Films of Martensitic Materials with Application to Large Strain Microactuators

Shu Y.C., California Institute of Technology, US

We propose a multiscale modeling to study the effective behavior of a heterogeneous thin film accounting in detail for the underlying microstructure, grain sizes and the film thickness. Motivated by the recent study of shape-memory [...]

Simulation Of Point Defect Clustering In Cz-Silicon Wafers On The Cray T3E Scalable Parallel Computer: Application To Oxygen Precipitation

Karouri F.S., Karoui A., Rozgonyi G.A., North Carolina State University, US

The oxygen precipitation in high purity CZ-silicon for ULSI is investigated with regard to the LO-HI and HI-LO-HI annealing processes used for denuded zone formation. The precipitation can be treated as a stochastic phenomenon and [...]

Ab initio Molecular Dynamics Simulations of Aluminum Ion Solvation in Water Clusters

Lubin M.I., Bylaska E.J., Weare J.H., University of California, US

The results of ab initio molecular dynamics simulations of the solvation of Al3+ and its hdrolyzation products in water clusters are reported. Al3+ ions in water clusters (6<n<16) form a stable hexa-hydrate Al(H20)3+6 complex in [...]

Self-Adapting Vertices for Mask-Layout Synthesis

Lee C.-Y., Antonsson E.K., California Institute of Technology, US

An efficient procedure for synthesizing MEMS mask-layouts for a desired 3-D shape is discussed. This method can greatly reduce the number of design and prototype iterations required to produce a desired device. The method is [...]

Modeling of Focused Ion Beam Trimming of Cantilever Beams

Lam T., Darling R.B., Univeristy of Washington, US

A finite element model of the cantilever beam is implemented to include a non-uniform thickness along its length, due to focused ion beam trimming. A quasi-static, iterative approach is used to calculate the cantilever profile [...]

Pre-Physical Design Analysis and Optimization of Repeaters Based on Technology Node, Materials, Devices, and Repeater Options

Lynch W.T., Independent Consultant, US

For the first time a comprehensive methodology has been applied to the pre-physical design of hierarchical interconnect wiring with consideration of the limitations of both the device and the wiring technologies (Fig. 1). The overall [...]

Modeling of the Self-Limiting Oxidation for Nanofabrication of Si

Chen Y., University of California, US

The self-limiting oxidation method has been frequently used to fabricate the nano-scale (e.g., sub-5 nm) Si columns and widely reported in the recent literature [1, 2]. However, few theoretical modeling has been carried out to [...]

Robust Ion-Implantation Process Design through Statistical Analysis

Sudhama C., Thoma R., Morris M., Christiansen J., Lim I-S., Motorola Digital DNA Labs, US

In this work, for the first time, we present a TCAD methodology to rigorously account for statistical variations due to these random process errors (inherent in all semiconductor processes), and thereby design a robust ion-implantation [...]

Full-chip Process Simulation for Silicon DRC

Sahouria E., Granik Y., Cobb N., Toublan O., Mentor Graphics Corporation, US

We have developed fast IC process simulation technique based on an empirical resist and etch models to compute the silicon image of designs as large as a full ULSI chip. The simulated silicon image is [...]

Process Simulation for Contact Print Microlithography

Darhuber A.A., Miller S.M., Troian S.M., Wagner S., Princeton University, US

Using a combination of experiment and simulations, we have studied the conformation of liquid microstructures on both at and corrugated, chemically heterogeneous substrates. The artificial surface patterns, which define regions of different surface energy, induce [...]