US – Page 208 – TechConnect Briefs

Modeling of a Surface Acoustic Wave Strain Sensor

Wilson W.C., Atkinson G.M., NASA Langley Research Center, US

NASA’s Integrated Vehicle Health Monitoring (IVHM) project is investigating new detection technologies that will increase aviation safety by monitoring the structural health of aerospace vehicles during flight. These new technologies must be rugged, light weight [...]

Carbon-based Nanoelectronic Devices for Space Applicatoins

Kaul A.B., Khan A.R., Megerian K.G., von Allmen P., Bagge L., Epp L., Baron R.L., Jet Propulsion Laboratory, US

The microelectronics industry based on Silicon (Si) continues to push the limits on scaling, which has created unique opportunities for nanoscale materials, such as carbon nanotubes (CNTs) and carbon nanofibers (CNFs). We will describe our [...]

Micromachined Glass-Blown 3-D Spherical Shells as Mechanical Vibratory Elements

Prikhodko I.P., Trusov A.A., Zotov S.A., Shkel A.M., University of California Irvine, US

This paper reports a non-contact experimental characterization of resonant modes in micromachined glass-blown spherical shells, enabling new architectures of vibratory 3-D MEMS for signal processing, timing, and inertial applications. Wafer-scale glassblowing was previously developed for [...]

Practical issues with ion beam milling in acoustic resonator technologies

Mishin S., Oshmyansky Y., Bi F., Advanced Modular Systems, Inc, US

A practical approach to addressing production issues of thickness trimming was demonstrated through two-step trimming, send-ahead wafer, and deposition/trimming cluster tool. Thickness control necessary in SAW/BAW technology was demonstrated.

Micro Crumples for Self-Assembly of Field Emission Devices

Sambandan S., Palo Alto Research Center, US

We study the electrostatic properties of crumpled conducting films, in particular the effective vertical electric field. The inspiration for this work is the possibility of self-organizing field emission devices with aims to reduce the cost [...]

Influence of resist composition on demolding force in UV nanoimprint lithography

Amirsadeghi A., Lee J., Park S., Louisiana State University, US

We investigated the influence of the Young’s Modulus (E) of UV resist on the measured demolding force in UV-NIL by varying compositions of UV-curable polymers. We found that decreasing crosslinking content of the polymers decreases [...]

VDK 4000 Direct Write System: A new approach to direct write technology

Theodore M., Fielding J., Royer J., Kalanovic V., Nirilovic J., Sears J., AFRL, US

VDK 4000 is a Flexible Robotic Environment (FRE) direct write system. The idea behind Flexible Robotic Environment (FRE) concept is building a robotic modular system around an application instead of having an application fit within [...]

Fabrication of biodegradable zein films by using soft lithography

Altunakar B., Kokini J.L., University of Illinois at Urbana-Champaign, US

Microfluidic components are widely used in the design of both bioanalytical and diagnostic microdevices. The miniaturized sample volumes together with modifications of the surface chemistry and localization of molecules within microfluid channels has opened many [...]

Functional lipid nanostructures fabricated by dip-pen nanolithography

Lenhert S., Florida State University, US

Combining the advantages of the structural, chemical, and lyotropic properties of membrane lipids with the nanostructuring capabilities of dip-pen nanolithograpy (DPN), makes possible creation of semisynthetic functional lipid nanostructures. Two examples of critical dimensions that [...]

Point-Mass Model for Nano-Patterning Using Dip-Pen Nanolithography (DPN)

Kang S-W, Banerjee D., Texas A&M University, US

Micro-cantilevers are frequently used as probes for micro-electromechanical systems (MEMS) based sensing applications. Usually micro-cantilever based sensors work by detecting changes in cantilever vibration modes (e.g., bending or torsional vibration frequency) or surface stresses - [...]