TW – Page 33 – TechConnect Briefs

Investigation of the Sequence-Dependent dsDNA Mechanical Behavior using Clustered Atomistic-Continuum Method

Yuan C.A., Han C-N, Chiang K.N., National Tsing Hua University, TW

A novel clustered atomistic-continuum method (CACM) based on the transient finite element theory is proposed herein to simulate the dynamic structural transitions of the double strand DNA (dsDNA) under external loading. Moreover, the meso-mechanics of [...]

Fabrication of Well-aligned and Mono-modal Germanium Dots on the Silicon Substrate with Trench-ridge Nano-structures

Chen P.S., Chen Y.J., Peng Y.H., Chen P.S., Chen Y.J., Kuan C.H., National Taiwan University, TW

Here we report the ability to fabricate well-aligned and mono-modal Ge dots on the silicon substrate with nano-trenches. It is started with electron beam lithography system (E-beam) to make patterns. Then reactive ion etching (RIE) [...]

Direct Wafer Polishing with 5 nm Diamond

Sung J.C-M, Tai M-F, Kinik Company, TW

CMP for making future semiconductor chips with nanom (nano meter) feature sizes can be accomplished by using nanom diamond particles embedded in an organic matrix (e.g. epoxy). Such nanom diamond particles are derived from the [...]

A Unified Compact Model for Electrostatic Discharge Protection Device Simulation

Chou H-M, Cho Y-Y, Chou H-M, Lee J.W., Li Y., National Chiao Tung University, TW

In modern microelectronics manufacturing, whole chip electrostatic discharge (ESD) protection circuit design is necessary for obtaining robust electrical performance [1-5]. In designing the whole chip ESD protection circuit, owing to its high circuit complexity, an [...]

In-situ Study of SAMs Growth Process by Cross Analysis of AFM Height and Lateral Deflection

Wu C-L, Tseng F-G, Chieng C-C, National Tsing Hua University, TW

We set a model for analysis the AFM image, by cross analysis multiple channel, we can investigate more nano scale information on surafce property.

Surface Reactions of Linear Atomic Metal Wire Complexes

Lung C-H, Chang C-C, National Taiwan University, TW

The communication among nanostructures and between these structures and the outside world becomes very critical as the key features in electronics devices continue to shrink in the double-digit nanometer regime. To explore the possible formation [...]

Optical Characterization of the Au Nanoparticle Monolayer on Silicon Wafer

Wang D-S, Chuang L., Lin C-W, National Taiwan University, TW

In recent years, self-assembly technique has been widely used in fabricating Au nanoparticle layer. It has drawn a lot of attentions owing to its promising application in biosensing.However, to date there have been very few [...]

Wurtzitic Boron Nitride on Diamond: The Ultimate Epitaxial Wafer for “Semiconductor on Insulator”

Sung J.C-M, Kinik Company, TW

In last four decades, the miniaturization of semiconductors devices (e.g. integrated circuitry) has been following Moore’s Law with feature (e.g. transistors) density double in about every 18 months. This relentless geometrical progression would require the [...]

Cermet Ceramic Coating on Diamond Dresser for In-Situ Dressing of Chemical Mechanical Planarization

Sung J.C-M, Kan K., Kinik Company, TW

In recent years, copper circuitry has been replacing aluminum wires and tungsten via as the dominant interconnections. The polishing of copper circuitry requires using highly acidic solution (e.g. pH = 4) and with strong oxidizing [...]

Field Emission of Nanostructured AlQ3 Amorphous Film and the Heat Treatment Effect

Cho C-P, Perng T.P., National Tsing Hua University, TW

There has been a particular interest in tris-(8-hydroxyquinoline) aluminum (AlQ3)-based devices for the development of large-area displays due to the unique properties such as excellent flexibility, high photoconductivity, and nonlinear optical behavior. It is then [...]