TW – Page 31 – TechConnect Briefs

A Parallel Intelligent OPC Technique for Design and Fabrication of VLSI Circuit

Yu S-M., Li Y., National Chiao Tung University, TW

Optical lithography is the key technology used in very large scale integrated (VLSI) circuit and systemon- a-chip (SoC) fabrication [1-3]. The exposure on wafer has distortions due to the proximity effects. Hence, a correction of [...]

Linear Analysis of Large Deflection of Heated and Clamped Isotropic Layered Plate Under Initial Tension

Chen C-F, Yu J.C., Chung-Hua University, TW

A simplified linear problem is studied for the large deflection of a clamped and heated isotropic circular layered plate under pretension and uniform loading (Fig. 1 and 2). Including a thermal consideration, governing equations based [...]

Investigation of Local-Strain Effect of the Nano-Scale Triple Gate Si/SiGe and SiN/Si Stacking MOS Transistor

Chang C.H., Chou C.Y., Peng C.T., Han C-N, Chiang K.N., National Tsing Hua University, TW

The tensile strained Si, based on the misfit between Si and SiGe gives higher speed and higher drive current for the metal oxide silicon field effect transistors. Based on the strained Si technology, a tri-gate [...]

Modeling of Laser Assisted Direct Imprinting Process Based on Pulsed Laser Heating and Elastodynamic Theory

Lee Y-C, Chuang C-H, Wang D-B, Liu C-P, Hsiao F-B, National Cheng Kung University, TW

Laser Assisted Direct Imprinting (LADI) is an efficient and direct way for fabricating nanostructures. In short, a quartz mold with nano-features is first pressed against a sample. Upon radiating a short laser pulse on the [...]

Numerical Investigation of Phase-Changing Heat Transfer for Laser-Assisted Direct Nano Imprint Processing

Hsiao F-B, Wang D-B, Jen C-P, Lee Y-C, Chuang C-H, National Cheng Kung University, TW

Laser-Assisted Direct Imprinting (LADI), a novel and promising technique, has been proposed since 2002 to utilize an excimer laser to irradiate and heat the silicon surface through a highly-transparent quartz mold preloaded onto the silicon. [...]

Design and Analysis of The CMOS Spatial Light Modulators with Flat Beam Profiles

Hsu C-P, Shih C-T, Wen S-Y, Chien Y-H, Hu C-C, Lee H.W., Industrial Technology Research Institute, TW

Two new types of electrostatic grating light modulators (GLMs) are proposed, designed, and analyzed here for improvement on optical wavefront distortion. The proposed GLMs consist different microbeam structures with spring-like legs to improve the flatness [...]

A Tunable Dispersive Optical System

Shieh K-W, Hsieh J., Chou H-Y, Precsion Instrument Development Center, TW

Pitch-tunable gratings can find many applications and have been widely investigated. However, they are limited to out-of plane type, which increase the cost for alignment and assembly. Instead, an in-plane type can built more micro [...]

Packaging Design with Thermal Analysis of LED on Silicon Substrate

Tsou C., Huang Y.S., Li H.C., Lai T.S., Feng Chia University, TW

In this paper, we demonstrate a package method for a package component of LED (Light Emitting Diode) using state of the art MEMS technologies and careful materials selection such as using a silicon substrate to [...]

The Design and Simulation of a Novel Out-of-plane Micro Electrostatic Actuator

Tsou C., Huang S.L., Lai T.S., Li H.C., Feng Chia University, TW

This paper presents a mechanism of developing a novel out-of-plane micro electrostatic actuator capable of causing large out-of-plane deflection. The proposed actuation mechanism is using the attraction force between the charged bodies to bend the [...]

On the Determination of Thermal Expansion Coefficient of Thermal Oxide

Tsou C., Huang Y.S., Chang H.C., Department of Automatic Control Engineering, Feng Chia University, TW

The accurate value of thermal expansion coefficient (a) of thin film is an important thermal property in the design of microelectronic devices and microsystem. This research presents a microbridge buckling deformation caused by the residual [...]