JP – Page 31 – TechConnect Briefs

Fail Pattern Classification and Analysis System of Memory Fail Bit Maps

Nakamae K., Itoh A., Fujioka H., Osaka University, JP

In order to determine problematic wafer processing steps rapidly during memory production, the system that classifies failure patterns from memory fail bit maps (FBMs) and estimates the cause of failure is proposed. The system mainly [...]

Simulation of Recess-Structure Dependence of Gate-Lag Phenomena in GaAs MESFETs

Horio K., Mitani Y., Wakabayashi A., Shibaura Institute of Technology, JP

We have made two-dimensional simulation of turn-on characteristics of recessed-gate and buried-gate GaAs MESFETs, and studied how the gate-lag or the slow current transient (which may occur due to surface states) is affected by the [...]

Three-Dimensional Effects Obtained from Capacitance Analysis of an SRAM Cell

Takemura Y., Osada K., Yagyu M., Yamaguchi K., Ushio J., Maruizumi T., Hitachi Ltd., JP

Employing Green's function method, we analyzed the 3D capacitance for the hole interconnect structure in an SRAM cell. We found novel 3D effects as follows; (1) via connection increases the capacitance of parallel lines, (2) [...]

On the Utility of Airborne MEMS for Improving Meteorological Analysis and Forecasting

Manobianco J., Short D.A., ENSCO, Inc., JP

Among the applications envisioned for Micro ElectroMechanical Systems (MEMS) sensors are weather observations from probes that are suspended in the atmosphere and carried by wind currents. This paper describes preliminary experiments with a state-of-the-science numerical [...]

Vibration Analysis of Quartz Yaw-Rate Sensor to Reduce Mechanical Coupling

Fujiyoishi M., Nononmura Y., Omura Y., Tsukada K., Matsushige S., Kurata N., Toyota Central R&D Labs, JP

For a yaw-rate sensor (gyroscope), the reduction of mechanical coupling phenomenon is a key technology for achieving high performance. We analyze the phenomenon with a combination of two models, (1) a static model of a [...]

Structural Design of Micro Electrostatic Actuator for Optical Memory Using Design Windows Searching Method

Ishihara D., Jeong M.J., Yoshimura S., Yagawa G., Kim Y.J., University of Tokyo, JP

For satisfactory design of micromachines, this paper describes a search method for a multi-dimensional design window (DW), which is defined as an area of satisfactory solutions in a feasible design parameter space. The method consists [...]

Wafer Fabrication Process Simulation Including Cost: Which Should be Used in an In-Line Wafer Inspection Strategy, High Sensitivity and High Cost Inspection Machine or Low Sensitivity and Low Cost Inspection Machine?

Nakamae K., Yamaji S., Fujioka H., Osaka University, JP

By combing an event-driven simulation method including costs and a simple VLSI particle-induced yield predictor, we discuss that which should be used in an in-line wafer inspection strategy, a high sensitivity & high cost inspection [...]

Simulation for Low Temperature Coefficient Design of Piezoresistive and Hall Sensors

Matsuda K., Kanda Y., Naruto University of Education, JP

Simulation for the temperature coefficient of piezoresistive and Hall sensors is presented. Carrier and ionized impurity concentrations in the n-type silicon gage are calculated from the charge balance equation by applying Newton iteration scheme. The [...]

The 2.4F2 Memory Cell Technology with Stacked-Surrounding Gate Transistor (S-SGT) DRAM

Suzuki M., Endoh T., Sakuraba H., Masuoka F., Tohoku University, JP

This paper reports that the Stacked-Surrounding Gate Transistor (S-SGT) DRAM achieves a cell size of 2.4F 2. The S-SGT DRAM is structured by stacking several SGT-type cells in series vertically. In order to realize cell [...]

Triboelectromagnetic Phenomena at a Simulated Material Combination of a Head/Magnetic-Recording-Disk

Nakayama K., Mechanical Engineering Laboratory, JP

The head slider of a magnetic recording apparatus is currently covered with a diamond like carbon (DLC) film, while the magnetic recording layer of the disk is overcoated with hydrogenated carbon film (HCF). The head [...]